Field Application Engineer - Defense and Aerospace

About TCLAD: TCLAD is a U.S.-based leader in thermal management and metal-clad printed circuit board (MCPCB) solutions for high-power electronics. Our technologies enable reliable performance in demanding applications where heat, isolation, and power density drive design complexity — from defense systems and aerospace power modules to electrification and data infrastructure.

Job Summary: The Field Applications Engineer (FAE) will serve as the primary external technical support for TCLAD’s customers in the Defense & Aerospace market and TCLAD’s sales and engineering team. This role will collaborate with customers to identify and drive differentiated value and design-in opportunities, translate application requirements into manufacturable PCB solutions, and support business growth through technical credibility, design wins, and customer advocacy.

Essential Duties and Responsibilities:

·        Drive design wins by engaging with engineering teams at Defense & Aerospace customers to secure design-ins of TCLAD’s thermally conductive PCB products.

·        Provide application and design guidance related to thermal performance, dielectric materials, and board stack-ups for high-power applications.

·        Create trust and increase TCLAD’s brand value by acting as the primary technical contact for target accounts, from concept through qualification and into production.

·        Collaborate closely with TCLAD’s product engineering, manufacturing, and sales teams to align technical solutions with customer needs.

·        Identify new project opportunities and influence specifications that drive long-term business growth.

·        Deliver product presentations, application notes, and design support materials to engineering and procurement teams.

Minimum Qualifications:

·        B.S. in Electrical, Mechanical, or Materials Engineering, or related field.

·        7 years in Field Applications, Design Engineering, or Technical Sales roles.

·        Proven history of design wins leading to measurable business growth.

·        Strong network within Defense & Aerospace OEMs, Start-ups and Tier 1s (Raytheon, Collins Aerospace, Northrop Grumman, Lockheed Martin, etc.).

·        Experience with high-power electronics, power management systems, and PCB application preferred.

·        Understanding of IPC standards, MIL-spec qualifications, and Defense/Aerospace material requirements.

·        Excellent communication and presentation abilities; strong problem-solving and customer advocacy skills.

·        US citizen

Personal Attributes:

·        Strategic thinker with a proactive approach.

·        Strong analytical and problem-solving skills.

·        Ability to work in a fast-paced, dynamic environment.

·        High level of integrity and professionalism.