RF/Microwave Modules Engineer

About Us

SuperApex LLC designs and manufactures high-performance RF and microwave products, including GaAs MMIC amplifiers, microwave circuits, and integrated RF modules. Our solutions serve customers across the defense, telecommunications, and research sectors worldwide. With facilities in the U.S. and Malaysia, SuperApex is rapidly expanding its R&D and advanced packaging capabilities in the 5G, SATCOM, and emerging 6G markets.

Position Overview

We’re seeking an experienced RF/Microwave Modules Engineer to lead the design, development, and testing of high-frequency integrated modules and subsystems. The ideal candidate will have a solid foundation in MMIC integration, packaging, and RF performance optimization across the ~0 GHz – 65 GHz range.

Key Responsibilities

• Design and develop RF/Microwave modules integrating MMICs, passive components, and antennas.
• Lead the design, layout, and packaging of RF front-end assemblies, including Antenna-in-Package (AiP) and System-in-Package (SiP) architectures.
• Perform RF simulations and circuit optimization using Keysight ADS, HFSS, and similar tools.
• Collaborate with mechanical, process, and test engineers to ensure electrical, thermal, and mechanical integrity.
• Conduct VNA, spectrum, and power measurements to characterize performance and validate designs.
• Develop test plans, procedures, and documentation consistent with ISO 9001 standards.
• Support new product introduction (NPI) from prototype through production.

Required Qualifications

• B.S. or M.S. in Electrical Engineering, Microwave Engineering, or a related field.
• 3 years of experience in RF/Microwave module or subsystem design.
• Proficiency with Keysight ADS, HFSS, or CST for circuit and EM simulation.
• Hands-on experience with RF test equipment: VNA, spectrum analyzer, power meters, and noise figure analyzer.
• Understanding of impedance matching, bias networks, and amplifier design (LNA, driver, PA).
• Experience with GaAs/GaN MMICs, hybrid modules, or multi-chip packaging.

Preferred Qualifications

• Experience with Antenna-in-Package (AiP) or module-level integration.
• Familiarity with III–V semiconductor processes (GaAs pHEMT, GaN HEMT).
• Knowledge of thermal management, interposers, and RF substrates (AlN, Rogers, etc.).
• Experience with high-frequency test automation using Keysight PathWave, BenchVue, or LabVIEW.
• Familiarity with ISO 9001 workflows and documentation.
• Excellent communication and problem-solving skills, with the ability to collaborate across global teams.

Why Join SuperApex

• Work on next-generation 5G and 6G RF modules with real-world impact.
• Collaborative, innovation-driven culture with strong R&D focus.
• Competitive salary, comprehensive benefits, and growth opportunities in a global company.