What are the responsibilities and job description for the ASIC Manufacturing Project Architect position at SolGenie Technologies, INC?
We’re hiring for a full-time opportunity with a leading semiconductor R&D organization in USA. This role focuses on ASIC Manufacturing Project Architect. Detailed job description is given below. Please share your resume to
Job Title: Project Architect – Backend (ASIC Manufacturing / Semiconductor)
Location: San Jose, CA (Onsite)
Type: Full-Time | Direct Hire with End Client
Experience: 10 Years
Job Summary
We are seeking an experienced Project Architect to lead technical customer engagements for ASIC/SoC manufacturing projects. The ideal candidate will have deep expertise in ASIC Packaging, Production Test, Qualification, OSAT management, and semiconductor manufacturing, along with strong project management and customer-facing experience.
Key Responsibilities
- Lead technical customer engagements for ASIC/SoC manufacturing projects.
- Define project scope, timelines, costs, risks, and Statements of Work (SOW).
- Provide technical expertise in ASIC Packaging, Production Test, Qualification, and Supply Chain.
- Collaborate with customers, business development, and cross-functional engineering teams.
- Manage multiple projects and support pre-sales activities.
Required Skills
- MSc/PhD in Microelectronics, Electrical Engineering, Physics, or related field.
- 10 years of experience in ASIC Post-Silicon Manufacturing.
- Strong expertise in:
- Package Design (FCBGA, WLCSP, QFN, QFP)
- Advanced Packaging (CoWoS, WoW, CoW)
- Wafer Sort & Final Test
- JEDEC Qualification (Automotive & Space)
- Production Test & Qualification Flows
- Experience working with OSATs, NPI, SOW preparation, and project management.
- Excellent communication and customer-facing skills.