What are the responsibilities and job description for the Intern, IC Packaging Thermal Analysis (Summer 2026) position at skhynixamerica?
Work Model: Onsite
Duration: June 2026 - August 2026
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We are offering an exciting opportunity at SK Hynix USA for IC Packaging Thermal Analysis Intern to join our dynamic engineering team. In this position, you will work on advanced semiconductor packaging projects, gaining hands-on experience in thermal modeling and characterization of advanced packages. You will be introduced to the basics of the advanced package design and manufacturing process flow. This is a very exciting opportunity for a candidate aspiring to build up professional growth and be part of SK Hynix success.
- Projects will be assigned to the intern(s): Advanced Memory & 3D Packaging Thermal Analysis
- Become familiar with various IC packaging structures and the process steps involved in making the end product.
- Learn the basics of using numerical analysis tools such as FloTHERM, Icepak etc.
- Start developing thermal FEA models to characterize the package/system level thermal resistance and other thermal performance parameters.
- Learn to interpret the thermal behavior of models and simulation results and correlate to observed behavior and measurements.
- Document all simulation models, codes and scripts and present the results in simple and clear terms to a broader audience.
Qualifications And Education Requirements:
- Currently pursuing a Master's or PhD's degree in Mechanical Engineering, Materials Science, or a related field.
- Strong interest in heat transfer, finite element analysis and its applications in semiconductor packaging.
- Strong problem-solving and analytical skills.
- Excellent communication and teamwork abilities, with a desire to collaborate effectively in a multidisciplinary environment.
Preferred Skills
- Currently pursuing a PhD's degree in Mechanical Engineering, Materials Science, or a related field.
- Familiarity with FEA software (e.g., FloTHERM, Icepak) is a plus.
- Basic understanding of semiconductor packaging concepts and materials is advantageous.
SKHYA is an Equal Employment Opportunity Employer. We provide equal employment opportunities to all qualified applicants and employees, and prohibit discrimination and harassment of any type without regard to race, sex, pregnancy, sexual orientation, religion, age, gender identity, national origin, color, protected veteran or disability status, genetic information or any other status protected under federal, state, or local applicable laws.
Our compensation reflects the cost of labor across several U.S. geographic markets, and we pay differently based on those defined markets. Pay within the provided range varies by work location and may also depend on job-related skills and experience. Your Recruiter can share more about the specific salary range for the job location during the hiring process.
Pay Range
$26 - $50 USD
Salary : $26