What are the responsibilities and job description for the System in Package Technologies Sr. Manager position at SK hynix America?
Job Title: System in Package Technologies Sr. Manager
Office Location: San Jose, CA
Work Model: Onsite
About SK Hynix America
At SK hynix America, we're at the forefront of semiconductor innovation, developing advanced memory solutions that power everything from smartphones to data centers. As a global leader in DRAM and NAND flash technologies, we drive the evolution of advancing mobile technology, empowering cloud computing, and pioneering future technologies. Our cutting-edge memory technologies are essential in today's most advanced electronic devices and IT infrastructure, enabling enhanced performance and user experiences across the digital landscape.
We're looking for innovative minds to join our mission of shaping the future of technology. At SK hynix America, you'll be part of a team that's pioneering breakthrough memory solutions while maintaining a strong commitment to sustainability. We're not just adapting to technological change – we're driving it, with significant investments in artificial intelligence, machine learning, and eco-friendly solutions and operational practices. As we continue to expand our market presence and push the boundaries of what's possible in semiconductor technology, we invite you to be part of our journey to creating the next generation of memory solutions that will define the future of computing.
Responsibilities
- Development of advance packaging technologies for 2.5D/3D heterogeneous integration with High Bandwidth Memory (HBM)
- Perform design and what if scenario analysis for novel advanced packaging schemes to improve system in package (SIP) performance
- Collaborate with internal and external stakeholders to ensure seamless advanced packaging technology development
- Identify and evaluate novel ideas and technologies with potential for future applications
Minimum Qualifications
- BS in Materials Science, Mechanical Engineering or equivalent industry experience
- 5 years of experiences in advanced packaging technology development and manufacturing
- In-depth knowledge in 2.5D/3D packaging technologies and large body substrate technologies
- Effective communication skills
- Experience working effectively with cross-functional teams
Preferred Qualifications
- Master Degree or PhD in Materials Science, Mechanical Engineering or equivalent industry experience
- 7 years of experiences in advanced packaging technology development and manufacturing
- In-depth knowledge in 2.5D/3D packaging technologies and large body substrate technologies
- Proven technical understanding of advanced packaging materials, their interactions, failure mechanisms and analytical techniques
- Effective communication skills
Benefits
- Top Tier health insurance at no employee cost
- Paid day offs: PTO Company Holidays Happy Fridays
- Paid Parental Leave Program
- 401k Matching
- Educational reimbursement up to $10,000 per year
- Donation Matching and volunteering opportunities
- Corporate discount programs
- Free Breakfast/Lunch/Dinner provided to employees
Equal Employment Opportunity
SKHYA is an Equal Employment Opportunity Employer. We provide equal employment opportunities to all qualified applicants and employees and prohibit discrimination and harassment of any type without regard to race, sex, pregnancy, sexual orientation, religion, age, gender identity, national origin, color, protected veteran or disability status, genetic information or any other status protected under federal, state, or local applicable laws.
Compensation
Our compensation reflects the cost of labor across several U.S. geographic markets, and we pay differently based on those defined markets. Pay within the provided range varies by work location and may also depend on job-related skills and experience. Your Recruiter can share more about the specific salary range for the job location during the hiring process.
Pay Range
$185,000 - $232,000 USD
Salary : $185,000 - $232,000