What are the responsibilities and job description for the Electro Mechanical Engineer position at Sira Consulting, an Inc 5000 company?
- 300 mm wafer handling design (edge‑grip, vacuum, kinematic support)
- Precision chuck design & compliant mechanisms
- FEA (ANSYS, Abaqus, COMSOL) — stress, modal, and contact analysis
- Modeling warped/bowed wafers, thin‑plate mechanics
- Cleanroom design principles – ISO Class 1, low‑particle mechanisms
- Vacuum system design, leak‑tight sealing, He‑leak testing
Material selection for semiconductor tools:
- PEEK, Vespel, PTFE, PPS
- Alumina, Aluminum Nitride, Ti‑6Al‑4V
- Hard anodize, DLC, TiN, Parylene coatings
Motion system design:
- Linear motors, voice‑coil actuators, pneumatic micro‑actuators
- Flexures, guides, cross‑roller bearings
- Jerk‑limited (S‑curve) motion and soft‑landing control
- Edge‑grip mechanism design with low clamping forces
- Tolerance analysis, GD&T, DFMEA, DOE
- Semiconductor standards familiarity: SEMI M1, M49, E57, E84, ISO 14644
Metrology & Testing Skills
- Warp, bow, TTV measurement techniques
- Particle measurement and contamination control
- Vacuum integrity tests (helium mass spectrometer, pressure decay)
- Wafer alignment and edge detection sensors (optical/capacitive)
- Reliability testing for 24/7 fab duty