What are the responsibilities and job description for the Strategic Student Program: Cross-Domain Electronics Systems Engineering Intern (T&I, Spring 2027) position at Siemens Digital Industries Software?
Siemens Industry Software Inc.
Strategic Student Program (SSP)
Discover your career with us at Siemens Industry Software!
We are a leading global software company dedicated to the world of computer aided design, 3D modeling and simulation - helping innovative global manufacturers design better products, faster! With the resources of a large company, and the energy of a software start-up, we have fun together while creating a world class software portfolio. Our culture encourages creativity, welcomes fresh thinking and focuses on growth, so our people, our business, and our customers can achieve their full potential.
We’re currently recruiting students for our Spring 2027 Strategic Student Program. Our intern positions will allow you to find a career path that most inspires you. Here, you will apply your education to solve real-world problems and turn theory into practice. At Siemens, our goal is to empower our students to become the next leaders of our company.
Baseline Requirements:
Cross-Domain Electronic Systems Engineering Intern
About The Team
The Cross Product Solution Management (CPSM) team researches and develops innovative solutions that demonstrate how modern engineering disciplines work together across semiconductor design, electronics, software, mechanical engineering, AI, and Product Lifecycle Management (PLM).
This internship offers the opportunity to contribute to a "silicon-to-rack" engineering initiative that showcases the integration of EDA, PLM, and AI-enabled workflows across the entire product development lifecycle.
What You'll Do
As an intern, you will work with senior engineers and technical specialists to:
Depending on project assignments, interns may gain experience in:
Contribute to the research, development, and documentation of a reference "silicon-to-rack" product development workflow demonstrating how modern EDA, PLM, and AI technologies connect semiconductor design, system design, mechanical engineering, and lifecycle management into a unified engineering ecosystem.
The initiative spans IC design, packaging, PCB, mechanical, and PLM domains within an integrated engineering workflow.
The hourly range for this position is $18.00 to $50.00. Siemens offers a variety of health and wellness benefits to employees. The actual compensation offered is based on the successful candidate’s work location, as well as degree type and relevant education. Details regarding our benefits can be found here: www.benefitsquickstart.com. In addition, this position is eligible for time off in accordance with Company policies, including paid sick leave and paid volunteer time off.
18 50
Strategic Student Program (SSP)
Discover your career with us at Siemens Industry Software!
We are a leading global software company dedicated to the world of computer aided design, 3D modeling and simulation - helping innovative global manufacturers design better products, faster! With the resources of a large company, and the energy of a software start-up, we have fun together while creating a world class software portfolio. Our culture encourages creativity, welcomes fresh thinking and focuses on growth, so our people, our business, and our customers can achieve their full potential.
We’re currently recruiting students for our Spring 2027 Strategic Student Program. Our intern positions will allow you to find a career path that most inspires you. Here, you will apply your education to solve real-world problems and turn theory into practice. At Siemens, our goal is to empower our students to become the next leaders of our company.
Baseline Requirements:
- Currently enrolled as a university student (MS or PhD or Undergraduate with plans to pursue graduate degree)
- Minimum 3.0 GPA
- Available to work Full-time starting Spring 2027
- Authorized to work in the United States without the need for current or future sponsorship by the company
- Hybrid – Wilsonville, OR; Detroit, MI
- Potential for full-time offers after university graduation and completion of the program
- Mentorship from senior engineers
- Individual career development planning
- Networking with our global leaders
- Professional and technical workshops
- Leadership opportunities
- Energetic student community
- Paid volunteer time off
- Employee discounts at our top customer sites
Cross-Domain Electronic Systems Engineering Intern
About The Team
The Cross Product Solution Management (CPSM) team researches and develops innovative solutions that demonstrate how modern engineering disciplines work together across semiconductor design, electronics, software, mechanical engineering, AI, and Product Lifecycle Management (PLM).
This internship offers the opportunity to contribute to a "silicon-to-rack" engineering initiative that showcases the integration of EDA, PLM, and AI-enabled workflows across the entire product development lifecycle.
What You'll Do
As an intern, you will work with senior engineers and technical specialists to:
- Research and evaluate emerging engineering technologies and workflows
- Develop software prototypes, automation tools, and proof-of-concept solutions
- Explore digital, analog, semiconductor, PCB, and system-level design concepts
- Document technical findings through white papers, tutorials, and technical guides
- Investigate AI-assisted engineering and documentation workflows
- Learn and utilize industry-leading EDA and PLM tools
- Help define and demonstrate an end-to-end engineering digital thread from silicon design through system deployment
Depending on project assignments, interns may gain experience in:
- C and Python development
- High-Level Synthesis (HLS)
- Semiconductor and IC design methodologies
- Analog and digital electronics
- 3D-IC and advanced packaging concepts
- PCB design and signal integrity
- Mechanical design integration
- Product Lifecycle Management (PLM)
- Technical documentation and workflow development
- Pursuing a Bachelor's, Masters, or Ph.D. degree in Mechanical Engineering, Robotics Engineering, Electrical Engineering, Computer Engineering, Computer Science, Electronics Engineering, or related STEM field
- Strong analytical and problem-solving skills
- Excellent verbal and written communication skills
- Ability to learn quickly and work independently
- Self-motivated, curious, and adaptable
- Exposure to digital logic, FPGA, embedded systems, or electronics design
- Interest in EDA, PLM, automation, or AI technologies
- Experience with Python, C , or other programming languages
- Familiarity with Linux or scripting environments
- Previous internship, co-op, or project experience a plus
Contribute to the research, development, and documentation of a reference "silicon-to-rack" product development workflow demonstrating how modern EDA, PLM, and AI technologies connect semiconductor design, system design, mechanical engineering, and lifecycle management into a unified engineering ecosystem.
The initiative spans IC design, packaging, PCB, mechanical, and PLM domains within an integrated engineering workflow.
The hourly range for this position is $18.00 to $50.00. Siemens offers a variety of health and wellness benefits to employees. The actual compensation offered is based on the successful candidate’s work location, as well as degree type and relevant education. Details regarding our benefits can be found here: www.benefitsquickstart.com. In addition, this position is eligible for time off in accordance with Company policies, including paid sick leave and paid volunteer time off.
18 50
Salary : $18 - $50