Hardware Engineer

Employment Type: Full-Time

Work Setting: In-office

Work Location: Hillsboro, Oregon, United States

Work Hours: Office hours

Find out more here: https://semianalysis.com

About SemiAnalysis

SemiAnalysis is an independent research and analysis firm specializing in the Semiconductor and AI industries. Our in-depth coverage spans the entire supply chain, from semiconductor fabrication processes to cutting-edge AI Models, software, and infrastructure. We are recognized as the leading authority on the semiconductor supply chain, with the highest concentration of industry experts within one team, and a deep-rooted passion for delving into the intricacies.

We’re a global team of over 20 analysts, each with extensive networks across the semiconductor supply chain and AI ecosystem, publishing industry‑shaping articles while participating in 40 conferences annually.

Our newsletter reaches more than 200 000 subscribers worldwide, including senior management and C‑suite leaders at the leading semiconductor and AI companies.

We also offer three core products:

• Industry Models – we develop and publish industry models on accelerator shipments, datacenter demand and supply, GPU total cost of ownership, and more. We work with hyperscalers, neoclouds, many of the world’s largest hedge funds, and government agencies.
• Core Research – our public equity markets product, geared towards financial investors, distills our deep technical research and knowledge into key insights on technology and product trends.
• Consulting and Technical Due Diligence – We conduct custom research and project work to guide key strategic and investment decisions for the largest private‑equity funds, leading venture‑capital firms, companies across the AI ecosystem, and government agencies.

Position Overview

We are seeking an experienced Hardware Engineer or Architect to join our team in the United States, specializing in AI and datacenter hardware. This role involves analyzing product architecture, design, and manufacturing processes. This role requires a mix of technical expertise, design sensibility, and autonomy. You’ll need to work independently, collaborate across our globally distributed team, to examine and report on the design choices, optimizations, and trade-offs in competing hardware, translating design and physical analysis into actionable insights.

Responsibilities

• Conduct detailed architectural analysis of AI and datacenter hardware (e.g., GPUs, ASICs, CPUs, and associated systems).
• Evaluate and benchmark hardware designs to identify competitive advantages, disadvantages, and generational changes.
• Analyze and document semiconductor manufacturing processes, including FEOL, BEOL, and advanced packaging techniques, based on physical inspection and analysis.
• Monitor and report on trends in semiconductor technology, process development, and device research.
• Perform as a recognized authority in the current state of the art in AI and datacenter hardware architectures.
• Work with manufacturing experts and market analysts to develop actionable market insights and reports.

Requirements

• 3 years of industry experience in architecture, product design, electrical failure or a reasonably equivalent role.
• Strong functional knowledge of AI and datacenter hardware architecture (e.g., GPUs, CPUs, accelerators) on advanced process nodes.
• Direct experience in physical or electrical failure analysis, fault isolation, device debug, or a related field.
• Understanding of Design Technology Co-Optimization (DTCO) principles and their application.

Preferred Skills

• Experience in product design or manufacturing R&D related to advanced packaging (e.g., 2.5D/3D), high-speed interconnects, and general advanced compute.
• Broad understanding of advanced manufacturing processes across CMOS logic, memory (HBM, GDDR), and emerging technologies.
• Proven ability to interpret analytical data, such as micrographs and electrical measurements, to infer design and process characteristics.
• Familiarity with Python for data analysis and complex engineering tasks.
• Strong professional network of experts with whom you comfortably and regularly communicate.
• Strong organizational skills and an understanding of statistics and process controls.

Growth Area

• Deepen expertise in next-generation AI hardware architectures, including custom accelerators, chiplet-based designs, and heterogeneous compute systems.
• Expand capabilities in advanced packaging and interconnect technologies (e.g., 2.5D/3D integration, HBM, optical interconnects) and their system-level implications.
• Develop stronger cross-layer understanding from device physics and manufacturing processes through system architecture and workload optimization.
• Build proficiency in data-driven hardware analysis, including benchmarking, performance modeling, and automated analysis using Python and related tools.
• Strengthen collaboration with research, manufacturing, and market teams to translate technical findings into high-impact strategic insights.
• Enhance external engagement through interaction with industry experts, conference participation, and contribution to thought leadership.
• Progress toward a senior architect or subject matter expert role with influence over research direction, technical coverage, and industry perspective.