What are the responsibilities and job description for the Solderer, BGA Repair (Temp to Full time) position at Sanmina and Careers?
Sanmina Corporation (Nasdaq: SANM) is a leading integrated manufacturing solutions provider serving the fastest-growing segments of the global Electronics Manufacturing Services (EMS) market. Recognized as a technology leader, Sanmina Corporation provides end-to-end manufacturing solutions, delivering superior quality and support to Original Equipment Manufacturers (OEMs) primarily in the communications networks, defense and aerospace, industrial and semiconductor systems, medical, multimedia, computing and storage, automotive and clean technology sectors. Sanmina Corporation has facilities strategically located in key regions throughout the world.
Solderer, BGA Repair
Job Purpose:
A BGA (Ball Grid Array) Repair Operator removes, replaces, and reflows complex surface-mount components on circuit boards using specialized rework stations, requiring precision, strong soldering skills and X-ray analysis for joint inspection, strict adherence to quality standards (IPC-A-610), and documentation to restore PCB functionality.
Nature of Duties:
- Component Rework: Safely desolder and remove defective BGA/SMT components and install new ones using automated/semi-automated rework systems (hot air, infrared).
- Site Preparation: Clean PCB pads, apply solder paste/flux, and prepare the area for new component placement.
- Placement & Reflow: Accurately align components and execute precise reflow profiles (thermal settings) to create strong solder joints.
- Quality Inspection: Visually inspect work and use X-ray inspection to check for shorts, insufficient solder, or other defects, ensuring adherence to IPC-A-610 standards.
- Documentation: Maintain logs, track repairs, and follow engineering instructions (ECOs, MPIs).
- ESD & Safety: Understand and follow ESD (Electrostatic Discharge) protocols and general safety practices.
Education and Experience:
- High School Diploma or equivalent and 1-2 years related experience
- Experience: Proven experience in BGA rework, component-level repair, and SMT processes.
- Certifications: IPC soldering certification preferred.
- Technical Skills: Proficiency with rework stations, microscopes, soldering irons, multimeters, and understanding thermal profiling.
- Soft Skills: Exceptional attention to detail, computer literacy, problem-solving, and communication.
Sanmina is an Equal Opportunity Employer