What are the responsibilities and job description for the Glass Core Technology (GCT) Engineering Manager position at Samtec, Inc?
Summary/Objective: The GCT Engineering Manager will lead a team of process engineers to innovate solutions to fabrication of electronic glass interposers. This person will be tasked with the challenge of sustaining and optimizing all processes utilized in GCT (Glass Core Technology). Knowledge of semiconductor-like wafer-based processes (lithography, CMP, PVD, plating, etc) is required. This individual should be comfortable in design development, sustaining product design, and cradle to grave lifecycle ownership.
Responsibilities:
- Engineering management of GCT technology development and implementation, including:
- Through glass via (TGV) fabrication and filling technologies
- Wafer-based fabrication processes to allow electrical, optical, and fluidic interconnects
- Process integration flows that enable novel device fabrication
- Collaborate with Operations to understand process and production issues and bottleneck, to ensure future development efforts provide continuous improvement solutions.
- Collaborate directly with Integration and Application engineering to identify technology gaps and developments needed to support new and existing business.
- Work closely with other Samtec development/product groups that are incorporating GCT components in their products to ensure the GCT devices work in their applications and understand enabling technologies required to be developed to align with their product and technology roadmaps.
- Create and execute technical project management plans with Samtec’s Project Management Office. This includes people/team direction and schedule management.
- Identify technical and resource gaps for continued development and work to fill them.
- Grow and develop the GCT engineering team.
Requirements:
- 10 years of experience in wafer engineering, wafer fabrication and engineering management strongly preferred.
- Must be a self-starter with strong leadership skills.
- Experience leading and working with technical staff.
- Expertise with Glass, Silicon, Semiconductor, or Hard drive wafer process development and integration, qualification and high-volume manufacturing strongly desired..
- Experience with fab equipment including lithography (i-line), PVD, CVD, wet etch, CMP, dry etch (RIE), ECD Cu plating, electrical test, and characterization is strongly desired.
- Demonstrated success at developing process flows which integrate process modules (litho, deposition, etch, CMP, etc.) to deliver new products for customers on time.
- Experience managing and growing an engineering group.
- Ability to work across functional groups and “lead from the side”
- Ability to communicate clearly and effectively with operators and senior management.
- Ability to meet International Traffic in Arms Regulations (ITAR) compliance requirements.
- Strong technical and verbal/written communication skills.
Preferred Education:
- Bachelor’s or Master’s degree in an Engineering discipline (Materials Science, Chemical Engineering, Chemistry, Physics, or related)