What are the responsibilities and job description for the Wirebond Process Operator position at S&C Micro?
- 2 years experience in hands-on micro packaging assembly that includes processes such as die bonding, wire bonding, dispensers, flip chip attach, and underfill
- Familiar with micro assembly equipment that range from manual, semi-auto, or fully automatic die bonders, wire bonders, testers, and microscopes.
- High dexterity for handling small components in prototype assembly environment
- Familiar with cleanroom and ESD protocols
- Able to trouble shoot basic issues with machines
- Eagerness to learn and mentor team members
Job Description:
- Hands-on machine set-up and operation for die bond, wire bond, wire pull/shear testers, dispensers, ovens, and high power microscopes
- Hands-on manual assembly where necessary
- Perform material quality inspection
- Work closely with engineers to constantly improve quality and process operations
- Observe safety, cleanroom, and ESD protocols