What are the responsibilities and job description for the Wafer Fabrication Operator position at Raytheon Missiles & Defense?
Job Description:
This is a 2nd shift position Tuesday - Friday 2:30PM - 1:00AM 4day 10 hour shift.
Work under limited supervision using process sheets, written and verbal instructions, and MES (manufacturing execution system) to perform a variety of silicon, gallium arsenide, gallium nitride and thin film operations as defined by supervision to produce integrated and hybrid circuits. Performs various wafer fabrication operations such as photo-masking, diffusion, metallization, and etching, and various assembly operations such as dicing, and die measurement and inspection.
Responsibilities:
-Ability to operate manual and automatic wafer fabrication and inspection equipment including but not limited to: Nitrogen blow guns, computer terminals, ultrasonic cleaners, microscopes and magnifiers., ovens, timers, meters, hot plates, plasma ashers, marking equipment, marking, wafer mounters, wafer saws, scribe and break equipment, CV plotters, ion implanters, alloy equipment, grinders, wafer washer, photo resist coaters and developers, mask aligners, probe test equipment, curve tracers, voltmeters, various cleaning, stripping, developing, electroplating and etching equipment, contact printers, coaters and developers, plasma deposition equipment, scanning electron microscopes, various descum and ash tools, strip, coat and develop tools, metal evaporation and metal sputter equipment, atomic layer deposition, plasma enhancement chemical vapor deposition, laser marking, etching tools, wax coating tools, automatic inspection systems, photolithography tools, ph and thickness measuring equipment.
-Ability to work with various hand tools including but not limited to: Tweezers, specific gravity meters, beakers, graduates, spray guns, vacuum and mechanical pickup handling aids, dispensers, work holders and other related hand tools and equipment.
-Ability to wear special cleanroom garments and PPE (personal protective equipment), wrist straps.
-Ability to work with various chemicals including, acetone, isopropanol, resist, solvents acids, alkaline cleaners and developers, and photo resists in conjunction with various cleaning equipment including but not limited to: laminar flow/acid hoods, high pressure solvent spray, ultrasonic cleaners, plasma cleaners, ultraviolet cleaners.
-Complies with company safe work practices.
-Works to verbal instructions, written operating specifications and computer instructions.
-Inspects product and/or materials to written criteria (OS, SCD, Mil Spec).
-Works within and across skill teams to perform various wafer fabrication operations.
-Operates multiple tools simultaneously where appropriate.
-Performs minor equipment setups as defined by procedures.
-Performs computer data entry as defined by procedures to support accurate record keeping and statistical process controls (SPC).
-Mixes and dispenses chemicals per defined procedures Performs general workplace maintenance and housekeeping.
-Performs other similar duties as required.
Required Qualifications:
-Requires high school diploma or equivalent.
-Minimum one year of related experience.
Desired Skills:
-Works to verbal instructions, written operating specifications and computer instructions.
This position will be covered by a collective bargaining agreement. Wage and work place conditions, including shift times, are subject to this agreement. Individuals hired into this position will be represented by a union.
161323
This is a 2nd shift position Tuesday - Friday 2:30PM - 1:00AM 4day 10 hour shift.
Work under limited supervision using process sheets, written and verbal instructions, and MES (manufacturing execution system) to perform a variety of silicon, gallium arsenide, gallium nitride and thin film operations as defined by supervision to produce integrated and hybrid circuits. Performs various wafer fabrication operations such as photo-masking, diffusion, metallization, and etching, and various assembly operations such as dicing, and die measurement and inspection.
Responsibilities:
-Ability to operate manual and automatic wafer fabrication and inspection equipment including but not limited to: Nitrogen blow guns, computer terminals, ultrasonic cleaners, microscopes and magnifiers., ovens, timers, meters, hot plates, plasma ashers, marking equipment, marking, wafer mounters, wafer saws, scribe and break equipment, CV plotters, ion implanters, alloy equipment, grinders, wafer washer, photo resist coaters and developers, mask aligners, probe test equipment, curve tracers, voltmeters, various cleaning, stripping, developing, electroplating and etching equipment, contact printers, coaters and developers, plasma deposition equipment, scanning electron microscopes, various descum and ash tools, strip, coat and develop tools, metal evaporation and metal sputter equipment, atomic layer deposition, plasma enhancement chemical vapor deposition, laser marking, etching tools, wax coating tools, automatic inspection systems, photolithography tools, ph and thickness measuring equipment.
-Ability to work with various hand tools including but not limited to: Tweezers, specific gravity meters, beakers, graduates, spray guns, vacuum and mechanical pickup handling aids, dispensers, work holders and other related hand tools and equipment.
-Ability to wear special cleanroom garments and PPE (personal protective equipment), wrist straps.
-Ability to work with various chemicals including, acetone, isopropanol, resist, solvents acids, alkaline cleaners and developers, and photo resists in conjunction with various cleaning equipment including but not limited to: laminar flow/acid hoods, high pressure solvent spray, ultrasonic cleaners, plasma cleaners, ultraviolet cleaners.
-Complies with company safe work practices.
-Works to verbal instructions, written operating specifications and computer instructions.
-Inspects product and/or materials to written criteria (OS, SCD, Mil Spec).
-Works within and across skill teams to perform various wafer fabrication operations.
-Operates multiple tools simultaneously where appropriate.
-Performs minor equipment setups as defined by procedures.
-Performs computer data entry as defined by procedures to support accurate record keeping and statistical process controls (SPC).
-Mixes and dispenses chemicals per defined procedures Performs general workplace maintenance and housekeeping.
-Performs other similar duties as required.
Required Qualifications:
-Requires high school diploma or equivalent.
-Minimum one year of related experience.
Desired Skills:
-Works to verbal instructions, written operating specifications and computer instructions.
This position will be covered by a collective bargaining agreement. Wage and work place conditions, including shift times, are subject to this agreement. Individuals hired into this position will be represented by a union.
161323
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