Thermal Engineer - Server Platform Engineering

Company:
Qualcomm Technologies, Inc.

Job Area:
Engineering Group, Engineering Group > Systems Engineering

General Summary:

Qualcomm Data Center team is developing High performance, Energy efficient server solution for data center applications. We are looking for highly talented, innovative, teamwork-oriented individuals for our cutting-edge technology work!

Our Mission

We are dedicated to transforming the industry by reimagining silicon and developing next-generation computing platforms. By joining our team, you'll collaborate with world-class engineers to create innovative solutions that push the limits of performance, energy efficiency, and scalability. Our focus is on developing reference platforms based on Qualcomm's Snapdragon SoC, delivering a comprehensive solution that includes hardware, software, reference designs, user guides, SDKs, and more.

About the Role

As an experienced Thermal Engineer (individual contributor), you will work closely with the platform team in developing high-performance servers, collaborating with cross-functional teams including packaging, electrical, mechanical, and component suppliers. You will be primarily responsible for hands-on lab work - conducting thermal testing, characterization, and validation - while also supporting thermal modeling and simulation efforts to develop and improve thermal solutions for high-performance computing systems.

Key Responsibilities

• Lead and execute hands-on thermal testing and characterization of server hardware, including heat sinks, cold plates, air cooling and liquid cooling solutions, wind tunnel evaluations, temperature measurements, and flow metrology.

• Validate and improve thermal models and solutions through rigorous lab testing, enhancing accuracy, and real-world robustness
• Support thermal simulations at the die/package/system level to analyze and optimize thermals, complementing experimental findings.
• Collaborate with internal teams - including packaging, silicon architecture, mechanical, and system engineering - to provide technical guidance and ensure alignment across requirements.

• Apply hands-on knowledge of thermal interface materials (TIMs) to evaluate, select, and qualify materials for high-performance electronics.
• Contribute to solving data center-specific thermal challenges, including rack-level cooling, high-density compute environments, and airflow management.
• Understand silicon architecture thermal challenges and develop capable thermal solutions that are critical to product performance and reliability.
• Develop and maintain documentation, guidelines, and tools to support design processes and project success.
• Prepare and present technical documentation and reports to stakeholders, including engineering teams, senior management, customers, and suppliers.

Qualifications

• Bachelor's or Master's degree in Mechanical Engineering, Engineering Mechanics, Material Science, or related field.
• 5 years of hands-on experience in thermal engineering within the high-tech industry - practical, lab-based experience is critical.
• Strong background in heat transfer fundamentals, including conduction, convection, and radiation.
• Proven hands-on experience with thermal testing equipment and methodologies, including:
  Heat sink and cold plate characterization
  Air cooling and liquid cooling systems
  Wind tunnel testing
  Temperature measurements (e.g., thermocouples, IR thermography)
  Flow metrology techniques
• Hands-on experience with thermal interface materials (TIMs) selection, application, and characterization.
• Familiarity with thermal challenges associated with package design and silicon architecture, and an understanding of why capable thermal solutions are critical to product performance and reliability.
• Some experience with thermal simulation tools (e.g., Celsius EC, Flotherm, Icepak) to support and complement experimental work.
• Proven ability to work independently and collaboratively within a cross-functional team environment.

Preferred Qualifications

• Experience addressing data center thermal challenges, including high-density compute and rack-level thermal management.
• Experience with Open Compute Project (OCP) product designs and standards.
• Advanced proficiency in CFD tools (e.g., Celsius EC, Flotherm, Icepak) for more complex simulations.
• Experience with scripting or programming languages (e.g., Python, MATLAB) for data analysis and automation.
• Familiarity with industry standards and best practices for thermal management in server and data center environments.
• Strong communication and presentation skills, with the ability to clearly convey complex technical concepts to diverse audiences.

Minimum Qualifications:
Bachelor's degree in Engineering, Information Systems, Computer Science, or related field and 6 years of Systems Engineering or related work experience.
OR
Master's degree in Engineering, Information Systems, Computer Science, or related field and 5 years of Systems Engineering or related work experience.
OR
PhD in Engineering, Information Systems, Computer Science, or related field and 4 years of Systems Engineering or related work experience.

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.

EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

Pay range and Other Compensation & Benefits:
$180,500.00 - $270,700.00

The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer - and you can review more details about our US benefits at this link.

If you would like more information about this role, please contact Qualcomm Careers.

Salary : $180,500 - $270,700