What are the responsibilities and job description for the Trumpf Laser Operator II position at PPS-HPS?
PPS is seeking an experienced Trumpf Laser Operator II to join our semiconductor industry operations in Chandler, AZ! This is a full-time position with a highly competitive pay rate, second-to-none benefits, and a high ceiling for growth!
Responsibilities:
- Essential Duties and Responsibilities • Set up and operate flat bed laser and punch equipment to produce flat pattern parts.
• Run parts made from aluminum, stainless steel, hot rolled steel, and cold rolled steel.
• Read and interpret complex blueprints and engineering drawings, including GD&T and tolerances.
• Understand, identify, and verify material types and material thicknesses prior to processing.
• Measure parts using calipers, micrometers, and other precision measuring tools to ensure conformance to specifications.
• Perform in-process and final quality checks; take ownership of part quality.
• Accurately complete all required paperwork, travelers, tagging, and part identification to ensure smooth flow to the next operation.
• Track labor accurately using the company labor tracking system.
• Maintain accurate part counts and verify quantities against job documentation.
• Perform preventative maintenance and routine housekeeping on assigned equipment.
• Identify and report equipment issues, quality concerns, or discrepancies to supervision.
• Follow all safety policies, procedures, and work instructions.
• Support continuous improvement efforts and maintain a clean, organized work area (5S).
The Ideal Candidate Will Possess:
- Experience operating Trumpf TruLaser 1030 and/or Trumpf 6000 equipment.
- Prior experience with laser and punch combination operations.
- Ability to read schematics work and complex instructions, how and make sure items are designed and built correctly.
- Able to read need to read and understand blueprints, schematics, models, and other specifications.
- Know the basic welding symbols, welding gases, straightening, and tweaking techniques and heat shrinkage.
- High School diploma or equivalent.
- Certification a plus.
- Semiconductor experience a plus.
- Ability to kneel, reach, walk, push, pull and grasp.
- Ability to lift up to 50 lbs.
- Ability to move arms, hands and fingers.
- Ability to sit for sustained periods of time.
- Required to wear personal protective equipment.
- Prolonged sitting with some standing and bending intermittently during work hours.
- Required to wear personal protective equipment where applicable.
- Subject to frequent interruptions.
- Ability to talk on phone and use computer for extended periods of time may be required.
- May involve exposure to moderate noise levels from printers, faxes, computers etc.