What are the responsibilities and job description for the Microelectronics Manager position at POLICY AND CAPABILITIES?
The Policy & Capabilities (PC) Directorate ensures the IC is best postured for the threats and challenges of an uncertain future, through strategy, policy, and capabilities development. PC is comprised of the Strategic Capabilities Office (SCO) and Policy Strategy and Accountability (PSA) Office.
Designing analog and digital circuits (e.g., FPGAs, ASICs, PCBs).
Use modeling/simulation to evaluate designs.
Extensive knowledge of Application Specific Integrated Circuit (ASIC) and Field Programmable Gate Array (FPGA) design.
Extensive experience organizing and managing their own projects or the projects of small teams.
Familiarity with basic electronic components such as ASICs, PCBs, microcontrollers, FPGAs, etc.
Experience using Electronic Design Automation (EDA) tools for ASIC and/or PCB design.
Demonstrated understanding and development of assembly specifications in accordance with industry standards.
Experience with application of 2D/3D imaging for hardware analysis.
Demonstrated ability to understand and synthesize new scientific and technical advances from a range of technical disciplines into policy or investment recommendations that will impact mission.
Education: Bachelor's degree in Engineering, Physics, or Materials Science.
Desired Requirements:
Extensive knowledge of Register Transfer Level (RTL) design including Verilog and VHDL.
Extensive knowledge of Digital/Analog Logic design/simulation, functional verification, Design For Test (DFT), testability analysis.
Extensive experience reverse engineering firmware or software.
Extensive experience in Information Assurance analysis or implementation.
Demonstrated understanding of the basic concepts of cryptography and cryptographic systems.
Demonstrated understanding of the basics of computer networking and low-level protocols.
Experience with embedded or operating system level programming.
These campaigns run from 18-36 months and are focused on establishing multi-agency capabilities that will transform the intelligence community (IC). The ideal candidate will apply detailed understanding of microelectronics design, manufacturing, use, and reverse engineering to advise ODNI, IC element, and interagency partners on current trends and emerging opportunities in support of a high-visibility Intelligence Community acquisition program. Applicants must have expert knowledge of Western and non-Western microelectronics manufacturing capabilities and be able to advise policy makers and senior decision makers on complex, technical issues.
Advise policy makers and senior decision makers on complex technical issues to enable informed decisions supporting a high-visibility multi-agency acquisition program.
Engage with industry counterparts to understand current developments and emerging trends.
Analyze, interpret, and assess information from industry to advise government counterparts on microelectronics acquisition and exploitation programs.
Develop, plan, and coordinate the acquisition and exploitation of foreign microelectronics.
Write and coordinate assessments of the capabilities of foreign microelectronics.
Develop test plans according to industry and military specifications.
Develop and sustain professional networks across the IC and in operational and analytic communities.
Qualifications:
Demonstrated knowledge of concepts, theories, and methods for designing, analyzing, testing, and integrating electrical and communications systems.Designing analog and digital circuits (e.g., FPGAs, ASICs, PCBs).
Use modeling/simulation to evaluate designs.
Extensive knowledge of Application Specific Integrated Circuit (ASIC) and Field Programmable Gate Array (FPGA) design.
Extensive experience organizing and managing their own projects or the projects of small teams.
Familiarity with basic electronic components such as ASICs, PCBs, microcontrollers, FPGAs, etc.
Experience using Electronic Design Automation (EDA) tools for ASIC and/or PCB design.
Demonstrated understanding and development of assembly specifications in accordance with industry standards.
Experience with application of 2D/3D imaging for hardware analysis.
Demonstrated ability to understand and synthesize new scientific and technical advances from a range of technical disciplines into policy or investment recommendations that will impact mission.
Education: Bachelor's degree in Engineering, Physics, or Materials Science.
Desired Requirements:
Extensive knowledge of Register Transfer Level (RTL) design including Verilog and VHDL.
Extensive knowledge of Digital/Analog Logic design/simulation, functional verification, Design For Test (DFT), testability analysis.
Extensive experience reverse engineering firmware or software.
Extensive experience in Information Assurance analysis or implementation.
Demonstrated understanding of the basic concepts of cryptography and cryptographic systems.
Demonstrated understanding of the basics of computer networking and low-level protocols.
Experience with embedded or operating system level programming.
Responsibilities:
ODNI's Policy and Capabilities (P&C) Directorate is squarely focused on winning the geostrategic competition to secure America's future. P&C establishes the IC's strategic roadmap, develops requisite IC policies, and drives technology capabilities in alignment with national priorities. Within P&C, the Strategic Capabilities Office (SCO) leads DNI-directed, results-oriented campaigns in key contested areas, including Mission Artificial Intelligence (AI), Advanced Compute, and Space & Sensors.These campaigns run from 18-36 months and are focused on establishing multi-agency capabilities that will transform the intelligence community (IC). The ideal candidate will apply detailed understanding of microelectronics design, manufacturing, use, and reverse engineering to advise ODNI, IC element, and interagency partners on current trends and emerging opportunities in support of a high-visibility Intelligence Community acquisition program. Applicants must have expert knowledge of Western and non-Western microelectronics manufacturing capabilities and be able to advise policy makers and senior decision makers on complex, technical issues.
Advise policy makers and senior decision makers on complex technical issues to enable informed decisions supporting a high-visibility multi-agency acquisition program.
Engage with industry counterparts to understand current developments and emerging trends.
Analyze, interpret, and assess information from industry to advise government counterparts on microelectronics acquisition and exploitation programs.
Develop, plan, and coordinate the acquisition and exploitation of foreign microelectronics.
Write and coordinate assessments of the capabilities of foreign microelectronics.
Develop test plans according to industry and military specifications.
Develop and sustain professional networks across the IC and in operational and analytic communities.
Salary : $121,785