Staff Liquid Cooling Thermal Engineer

Piper Companies is seeking a Staff Liquid Cooling Thermal Engineer with strong experience developing thermal liquid cooling strategies with specialized hardware for a up and coming AI tech company. The senior Thermal Engineer position is a fulltime opportunity and must be willing to work onsite 5 days a week in Saratoga, CA.

Requirements for the Staff Liquid Cooling Thermal Engineer include:

• Develop thermal cooling strategies for high-performance and high speed ASIC’s.
• Conduct engineering tests to verify designs and support thermal analysis for hardware devices.
• Perform package design for custom SI single-chip and multi-chip
• Conduct design analysis and scenarios for novel packaging technologies, including liquid cooling and mechanical design of robust package substrates
  
  

Qualifications for the Staff Liquid Cooling Thermal Engineer include:

• 10 years of experience in advanced packaging with surface mount technology and assembly process development and manufacturing
• 3-5 years of direct professional experience in thermal design; using Icepak, FloTherm, SmartCFD, etc.
• Experience with high power SOC liquid cooling design and analysis
• Advanced understanding of electric cooling challenges in data center environments and heat transfer modes
• Bachelors in Material Science, Mechanical Engineering, or equivalent industry experience
• Must be eligible to work in the United States and obtain and maintain an Active U.S Government Secret Clearance
  
  

Compensation for the Staff Liquid Cooling Thermal Engineer include:

• Salary range: $160,000 - $200,000 annually
• Comprehensive benefit package; Cigna Medical, Cigna Dental, Vision, 401k w/ ADP plus PTO, Sick leave if required by law, and Paid Holidays
  
  

Keywords: Thermal Engineer, thermal analysis, thermal, engineer, thermal cooling, ASIC, thermal design, Icepak, FloTherm, Flotherm, SmartCFD, hardware, product management, packaging technology, SMT, solder ball attach, networking products, network, photonics, photonic integration, Si single-chip, Si multi-chip, SiPi packaging, PCB, system co-design, ODM SMT manufacturing, liquid cooling, FMEAs, SOC liquid cooling, open loop system, closed loop system, CFD, FEA, electronic cooling, heat transfer, thermal airflow testing, mechanical validation, mount technology,

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This job opens for applications on 4/3/2026. Applications for this job will be accepted for at least 30 days from the posting date.