Integration Engineer

onsemi is seeking a Manufacturing Integration Engineer in our EFK Hopewell Junction site. We are a leading innovator in semiconductor technology, dedicated to advancing power electronics through cutting‑edge research and development. We are seeking a talented and motivated staff engineer to join our team and drive Technology transfers and Manufacturability of next‑generation discrete power FET technologies and CMOS. This role offers high technical ownership, cross‑functional visibility, and the opportunity to directly shape onsemi’s future power device roadmap

• Responsibilities

• Technology transfer and manufacturability for onsemi’s advanced nodes of discrete power FETs, owning device architecture from concept definition through qualification and high‑volume manufacturing.
• Monitor electrical performance and device performance, collaborating with design, process integration, and modeling teams to optimize Rds(on), switching performance, ruggedness, and power density.
• Partner with process module owners in the fab to optimize process windows, ensure device robustness, and resolve integration challenges.
• Perform device characterization, electrical testing, and failure analysis, ensuring compliance with specifications and customer requirements.
• Drive structured root‑cause analysis (DOE, 6‑sigma, SPC, FMEA) for yield, reliability, or device‑related issues, and implement sustainable corrective actions.
• Collaborate with systems engineering, product engineering, packaging, and applications teams to integrate power FETs into system‑level solutions and end‑customer applications.
• Provide technical guidance, coaching, and mentorship to junior engineers; matrix‑manage engineers across multiple organizations.
• Present technical content in executive‑level reviews and represent the team in cross‑functional and customer‑facing discussions.

Qualifications

Qualifications

• Master’s or Bachelor's degree in Electrical Engineering, Materials Science, Physics, or a related field.
• 5 years of experience in semiconductor manufacturing, specifically with discrete power FETs (trench MOSFETs, superjunction, CMOS, or related structures).
• Experience with post wafer fab operations such as Back-Grind/Back Metallization, Packaging, Dicing and Singulation, module construction.
• Experience with wafer level testing, ILT/WAT/PCM and Probe. Familiarity with package level Final Testing especially for discrete power devices
• Experience taking technologies from early manufacturing to high volume ramp.
• Understanding of semiconductor physics, device reliability, and fabrication processes, including experience in 300mm fabrication.
• Demonstrated ability to translate high‑level objectives into actionable engineering plans and drive projects independently.
• Strong data‑driven problem‑solving skills using DOE, statistical analysis, SPC, 6‑sigma, and FMEA methodologies.
• Track record of leading or significantly contributing to technology development projects with measurable impact on performance, reliability, yield, or cost.
• Excellent communication skills with the ability to present complex technical topics clearly to both engineering and executive audiences.
• Ability to manage multiple projects simultaneously in a fast‑paced development environment

Salary: onsemi is excited to share the base salary range for this position is $101,700 to $172,700 exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of internal equity of our current team members. We also offer a competitive benefits package. https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf