What are the responsibilities and job description for the Electro Mechanical Engineer position at OKAYA INFOCOM?
Job Title: Electro Mechanical Engineer
Location: Springfield, VA (Onsite)
Contract Type: Contract on (W2 / C2C)
Job Description & Skill Requirement:
Key Responsibilities
Design 300 mm wafer chucks including vacuum chucks, edge‑grip mechanisms, compliant fingers, and kinematic supports.
Perform stress, deformation, and warp accommodation modeling to ensure ultra‑low wafer stress during handling.
Develop motion mechanisms for raise/lower (Z‑axis) and edge‑grip actuation that prevent wafer damage and meet precision requirements.
Ensure all designs meet ISO Class 1 cleanroom particle generation specifications and support high‑volume, 24/7 fab operation.
Select appropriate low‑outgassing, non‑particulating materials (e.g., PEEK, Vespel, Alumina, DLC, etc.) and coatings suitable for semiconductor tools.
Work with controls engineers on soft‑landing, jerk‑limited motion profiles, and closed‑loop sensing for wafer presence, alignment, and force control.
Conduct FEA simulations for thin‑wafer stress, contact mechanics, modal behavior, and static/dynamic loads.
Perform particle testing, vacuum leak testing, wafer stress validation, and endurance testing.
Generate engineering documentation: DFMEA, test plans, tolerance stackups, and SEMI/ISO compliance documents.
Collaborate with cross‑functional teams (systems, electronics, materials, manufacturing) for prototype builds and tool integration.
Skill Requirements
Technical Skills
300 mm wafer handling design (edge‑grip, vacuum, kinematic support)
Precision chuck design & compliant mechanisms
FEA (ANSYS, Abaqus, COMSOL) - stress, modal, and contact analysis
Modeling warped/bowed wafers, thin‑plate mechanics
Cleanroom design principles - ISO Class 1, low‑particle mechanisms
Vacuum system design, leak‑tight sealing, He‑leak testing
Material selection for semiconductor tools:
PEEK, Vespel, PTFE, PPS
Alumina, Aluminum Nitride, Ti‑6Al‑4V
Hard anodize, DLC, TiN, Parylene coatings
Motion system design:
Linear motors, voice‑coil actuators, pneumatic micro‑actuators
Flexures, guides, cross‑roller bearings
Jerk‑limited (S‑curve) motion and soft‑landing control
Edge‑grip mechanism design with low clamping forces
Tolerance analysis, GD&T, DFMEA, DOE
Semiconductor standards familiarity: SEMI M1, M49, E57, E84, ISO 14644
Metrology & Testing Skills
Warp, bow, TTV measurement techniques
Particle measurement and contamination control
Vacuum integrity tests (helium mass spectrometer, pressure decay)
Wafer alignment and edge detection sensors (optical/capacitive)
Reliability testing for 24/7 fab duty
Software Skills
CAD: SolidWorks, Creo, NX
Simulation tools: ANSYS/Abaqus/COMSOL
Data tools: MATLAB, Python
Motion/controls: Beckhoff TwinCAT, Siemens/Omron PLCs
Soft Skills
Strong cross‑functional collaboration
Root cause analysis (8D, 5‑Whys, Ishikawa)
Clear documentation & communication
Ownership and design‑for‑reliability mindset