What are the responsibilities and job description for the Semiconductor R-10063588 Photo/Metrology Equipment Engineer position at NXP Semiconductors?
Equipment Engineering Role in ECHO Fab: Skills in Equipment Knowledge and Understanding; Safety & Compliance; Problem‑Solving Systems (WSS, troubleshooting trees); Root Cause Analysis; Equipment Fundamentals; Managing Sustaining Metrics (availability, alarms, scrap); OEE System Thinking; Escalation Discipline; FDC / Advanced Analytics & Scripting; FMEA / DFMEA Facilitation MTBF / MTTR Analysis; Tool Acceptance & Automation / MES Familiarity; Standard Work & 5S; Results Orientation / KPIs Mindset; Written/Verbal Communication Skills; Influencing up/down & Stakeholder Alignment; Vendor / Partner Management; Audit & Customer‑Facing Presence; Cost Literacy; Coaching; Prioritization; Delegation; Collaboration & Teamwork; Bias for Action with Rigor; Adaptability & Learning Mindset; Manage Ambiguity; Material Science Fundamentals.
Primary Responsibilities:
- Responsible for multiple processes and tool ownership in a high-volume manufacturing facility
- Identify and reduce sources of variation, implementing zero defect processes, reducing defectivity, defining tool qualification/PM procedures, improving tool utilization and availability, reducing cycle time, identifying, and qualifying new tools, and supporting development or transfer activities.
- Sustaining – lead troubleshooting efforts, manage critical part inventory, direct supplier activities, responsive to SPC/ FDC excursions, writing specifications, training maintenance techs…
- Improving – forming/executing plans for continuous improvements, implementing hardware/software upgrades, developing preventative actions to SPC/ FDC excursions…
- Expanding – increasing tool capabilities/throughput/availability, determining new sourcing for parts/service/toolsets, installation/qualification of new equipment/components
Qualifications:
- Bachelor’s degree or higher in a technical discipline is required, prefer mechanical or industrial engineering or similar.
- Experience in one of the following area’s Photo, Metrology or Plating tools Preferred
- Manufacturing experience (semiconductor preferred) in process or equipment engineering over a variety of toolsets.
- Ability to interact professionally with manufacturing and process engineering to effectively understand problems and efficiently resolve them.
- Ability to generate, analyze, and interpret equipment performance data and produce a timely action plan to resolve recurring equipment failures.
- Demonstrated presentation skills with ability to present complex datasets and equipment problems/ solutions to diverse audiences.
- Competent in troubleshooting problems and capable of applying logic to identify and technical skills to understand actions needed to implement/verify the repair.
- Ability to deal with multiple issues and shifting priorities.
- Strong verbal and written communication skills. Candidate will be called upon to train others and write clear procedures.
- Self-motivated; able to take initiative and effectively prioritize work for self.
- Participating in and/or leading cross-functional teams fostering collaboration to achieve a specific goal.
- A strong desire to help create a positive, winning, world class working environment.
- Safety and Quality minded approach and work habit
- Must be able to obtain and maintain an Export Control Clearance