What are the responsibilities and job description for the Photolithography Equipment Engineer position at NXP Semiconductors N.V.?
Business Line Description:
NXP's Front End Operations plays an essential role in the company's success by ensuring manufacturing excellence and delivery of high quality, scalable, and cost-competitive semiconductor devices to create a winning advantage for our Customers.
Job Summary:
Photolithography Equipment Engineer in a high-volume semiconductor wafer manufacturing environment. Prior experience with semiconductor manufacturing process is required. Previous equipment experience with ASML Scanner PAS5500/400/700 Scanners is required. Experience with Canon Stepper, TEL ACT 8 or Mark 7 track, KLA 8100 CDSEM/KLA SL3/Archers/UVs/ASET/HRPs, Onto IRIS is desirable.
Key Challenges:
Cross functional aspects:
Job Qualifications:
More information about NXP in the United States...
NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.
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NXP's Front End Operations plays an essential role in the company's success by ensuring manufacturing excellence and delivery of high quality, scalable, and cost-competitive semiconductor devices to create a winning advantage for our Customers.
Job Summary:
Photolithography Equipment Engineer in a high-volume semiconductor wafer manufacturing environment. Prior experience with semiconductor manufacturing process is required. Previous equipment experience with ASML Scanner PAS5500/400/700 Scanners is required. Experience with Canon Stepper, TEL ACT 8 or Mark 7 track, KLA 8100 CDSEM/KLA SL3/Archers/UVs/ASET/HRPs, Onto IRIS is desirable.
Key Challenges:
- Identification and reduction of reoccuring machine faults
- Creation of hard down action plans driving to root cause
- Developing and improving tool maintenance procedures
- Training maintenance technicians
- Reducing overall cost of equipment and scrap
- Improving tool utilization and availability
- Participating in and/or leading cross-functional and lean activity teams
- Supporting process development activities
- Sourcing and releasing new equipment
- Training maintenance technicians
- Knowledge of Six-Sigma root cause problem solving, SPC, 8D, FMEAs
Cross functional aspects:
- Working closely with Photo process team to identify and reduce source of process variation and implementing zero defect process
Job Qualifications:
- Must have a BS or MS degree in engineering or a degree in relevant field of studies
- More than 5 years of process engineering experience in a similar high volume semiconductor manufacturing environment
More information about NXP in the United States...
NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.
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