What are the responsibilities and job description for the Staff PIC Process Engineer position at Nokia?
Job Description
As a Staff PIC Process Development Engineer, you will be a senior individual contributor within Nokia’s Optical Components organization, responsible for the development, optimization, and transfer of InP photonic integrated circuit (PIC) and laser fabrication processes for high‑volume manufacturing.
This role requires deep technical expertise across epitaxial design, semiconductor processing, data‑driven manufacturing analysis, and close collaboration with remote fabrication partners. You will play a key role in enabling next‑generation optical component technologies that support Nokia’s high‑capacity optical networking platforms.
How You Will Contribute And What You Will Learn
Process Development & Integration
As a Staff PIC Process Development Engineer, you will be a senior individual contributor within Nokia’s Optical Components organization, responsible for the development, optimization, and transfer of InP photonic integrated circuit (PIC) and laser fabrication processes for high‑volume manufacturing.
This role requires deep technical expertise across epitaxial design, semiconductor processing, data‑driven manufacturing analysis, and close collaboration with remote fabrication partners. You will play a key role in enabling next‑generation optical component technologies that support Nokia’s high‑capacity optical networking platforms.
How You Will Contribute And What You Will Learn
Process Development & Integration
- Lead the design, development, and optimization of InP PIC and laser fabrication processes for high‑volume manufacturing
- Design and specify epitaxial layer structures in collaboration with device designers and epitaxy suppliers
- Develop complete fabrication process flows based on design requirements, tool capabilities, and manufacturing constraints
- Drive process integration, ensuring compatibility across metal, semiconductor, and dielectric modules
- Perform extensive data analysis of photonic device, wafer, and process data in a manufacturing environment
- Apply SPC, process capability analysis (Cp/Cpk), and statistical methods to monitor and improve process performance
- Lead or contribute to FMEA activities, root cause analysis, and corrective actions for yield and reliability issues
- Define and utilize metrology strategies to ensure robust process control
- Shepherd wafers successfully through the fab, coordinating closely with test, development, integration, and fabrication engineers
- Act as a senior technical interface with external or remote fabrication facilities, ensuring alignment on process execution and priorities
- Collaborate with device design, product engineering, and reliability teams to support technology readiness and product ramp
- Provide technical leadership within the PIC process development domain
- Contribute to continuous improvement of tools, methods, and best practices
- Mentor junior engineers and support knowledge transfer across the broader team
- Ph.D. in Electrical Engineering, Physics, or a related field
- Minimum 3 years of industry experience developing and manufacturing InP PIC or laser fabrication processes for high‑volume applications
- Demonstrated expertise in:
- Design of epitaxial layer structures
- Process design and fabrication process development for InP devices or PICs
- Photonic device data query and analysis in a manufacturing environment
- Metal, semiconductor, and dielectric deposition and etching tools, chemistries, and methods
- FMEA, SPC, process capability, and metrology
- Building end‑to‑end fabrication process flows from tool and design specifications
- Proven ability to work effectively with remote fabs and cross‑site teams
- Experience supporting technology transfer to high‑volume manufacturing
- Familiarity with yield ramp, qualification, and reliability testing for photonic devices
- Strong communication skills with the ability to translate complex technical issues across disciplines
- Experience working in foundry or captive fab environments supporting compound semiconductor technologies