What are the responsibilities and job description for the IC Package Design Researcher position at Nokia?
Job Description
You will realize next-generation packaging solutions by identifying, integrating, and validating novel materials. It is a highly cross-functional role, engaging RF/EM, mechanical/thermal, optical integration, reliability, supplier, and manufacturing teams. The ideal candidate brings a strong materials science and packaging background, hands-on process know-how, and a data-driven approach to reliability-by-design.
How You Will Contribute And What You Will Learn
You will realize next-generation packaging solutions by identifying, integrating, and validating novel materials. It is a highly cross-functional role, engaging RF/EM, mechanical/thermal, optical integration, reliability, supplier, and manufacturing teams. The ideal candidate brings a strong materials science and packaging background, hands-on process know-how, and a data-driven approach to reliability-by-design.
How You Will Contribute And What You Will Learn
- Identify, integrate, and qualify novel materials into advanced microelectronics packages (e.g., dielectrics, interconnects, adhesives, TIMs, etc.).
- Drive package and test fixture design from architecture planning to CAD generation to system level validation, including mechanical, thermal, electrical, and optical design and accelerated reliability testing.
- Plan and execute material and package characterization and failure analysis.
- Collaborate with OSATs, Foundries, and material suppliers to validate new process flows and materials and identify and resolve failure mechanisms.
- Build data-backed acceptance criteria for novel materials and correlate lab measurements with modeling results to inform design trade-offs.
- M.S. or Ph.D in Materials Science/Engineering, Mechanical Engineering, Electrical Engineering, Physics, Chemistry or a related field, with 5 years in microelectronics packaging.
- Hands-on experience with at least some of the following tools for package and system design (e.g., Cadence Allegro, Xpedition , Altium) and mechanical/thermal/EM simulation (e.g. Creo/ Solidworks , Ansys Mechanical, FloTHERM / Icepak , HFSS, CST).
- Proficiency in characterization methods and failure analysis (Radiography, RF S-parameters, optical insertion loss, DMA/TMA, SEM, AFM, etc.)
- Experience with wafer-level and substrate fabrication processes and the ability to identify and de-risk new processes.
- Strong cross-functional collaboration and communication skills, with the ability to translate complex experimental data into clear design and process recommendations for both technical and non-technical stakeholders.