Packaging Technician

Materials & Packaging Technician Responsibilities

• Perform mechanical drilling of organic substrates
• Conduct surface preparation and treatment
• Execute via plating, via fill, and button plating
• Apply dry and wet photoresist lamination, exposure, and development
• Perform wet etching and photoresist stripping for patterning
• Apply dry/wet solder mask
• Conduct ENIG (Electroless Nickel Immersion Gold) plating
• Perform the singulation of organic substrates
• Laminate build-up film
• Operate laser drilling of wafers
• Execute electroless copper plating, electrolytic plating, and flash etching
• Apply metallic plating and dielectric deposition
• Spincoating of photoresist
• Conduct wet etching of metals, photoresist lift-off, and dielectric patterning.
• Perform backside grinding
• Dicing
• Fabricate stencils and screens
• Perform screen printing or stencil printing
• Conduct post-print baking and sintering
• Perform wire bonding
• Conduct die attaching
• Execute flip-chip packaging processes.
• Apply underfill materials
• Perform BGA (Ball Grid Array) ball placement and reflow.
• Conduct DC/RF probing
• Prepare cross-sections
• Perform micrography imaging
• Generate high-quality, regular reports and detailed project documentation.
• Maintain consistent attendance and punctuality
• Ensure the cleanliness and organization of the lab
• Manage lab stocking and inventory
• Follow safety protocols

Minimum Qualifications

• High School Education/GED or equivalent.
• This is an entry-level role.
• Experience with advanced packaging, printed circuit board assembly (PCBA), 2.5D/3D integration, and/or related technologies
• Experience with handling and integration of back end of line (BEOL) technologies including: thinning, dicing, soldering, eutectic bonding, metal finishing/electrochemical deposition, through silicon via (TSV), flip-chip, wire/die bonding, ball/stud bumping, thermocompression bonding, copper pillar bonding, hybrid bonding, underfill, over molding and/or other encapsulation methods
• Demonstrated successful outcomes in instrumentation and characterization methods, electrical layout, mechanical design, data analysis or related areas.
• Experience in the use of high-performance electronic materials

Desired Qualifications

• B.S or more degree in the field of Electrical Engineering, Applied Physics, Material Science, or a related field
• Experience in the domain of advanced packaging, including 2.5D/3D integration or similar technologies
• Experience in System-in-Package (SiP) and/or Multi-Chip Module (MCM) design, manufacturing, and validation

Job Type: Full-time

Benefits:

• Dental insurance
• Employee assistance program
• Employee discount
• Health insurance
• Health savings account
• Life insurance
• Paid time off
• Professional development assistance
• Relocation assistance
• Vision insurance

Schedule:

• 8 hour shift
• Monday to Friday

Education:

• High school or equivalent (Required)

Experience:

• flip-chip, wire/die bonding, ball/stud bumping: 2 years (Required)
• advanced packaging: 2 years (Required)
• 2.5D/3D integration and/or related techonologies: 2 years (Required)
• handling and integration of thinned components: 2 years (Required)
• development and use of high performance electronic materials: 2 years (Required)
• thinning, dicing, soldering, eutectic bonding: 2 years (Required)

Ability to Relocate:

• Renton, WA 98057: Relocate before starting work (Required)

Work Location: In person