Principal Wafer Bonding Integration Engineer

Product Development & Manufacturing Integration

• Own wafer bonding integration strategy from early product development through high-volume manufacturing.

• Partner with design engineering, process development teams, and external foundries to develop robust manufacturing flows.

• Lead process transfer activities and ensure manufacturable, repeatable bonding solutions across multiple foundry partners.

• Serve as the primary technical interface between nEye engineering teams and external fabrication partners throughout NPI.

• Drive process readiness for new product introductions, ensuring schedule, yield, quality, and reliability objectives are achieved.

Wafer Bonding Process Integration

• Develop and optimize advanced wafer bonding processes including:

  • Fusion Bonding

  • Eutectic Bonding

  • Hybrid Bonding

  • Direct Wafer Bonding

  • (Anodic bonding experience is beneficial but not required)

• Define bonding process windows, alignment strategies, thermal budgets, and material compatibility.

• Optimize surface preparation, cleaning, activation, CMP requirements, and post-bond processing.

• Develop integration strategies that balance bonding performance with downstream manufacturing requirements.

• Collaborate with packaging and process integration teams on bonded wafer architectures.

Foundry Collaboration

• Lead technical engagement with external foundries throughout process development and manufacturing.

• Support tape-outs, process qualifications, engineering builds, and production ramps.

• Review process data, SPC metrics, excursion reports, and corrective actions with foundry partners.

• Drive continuous improvements in yield, manufacturability, reliability, and cost.

• Coordinate engineering experiments and process characterization across multiple manufacturing partners.

Yield Improvement & Failure Analysis

• Analyze wafer-level metrology and inspection data to identify process limitations and failure mechanisms.

• Lead root cause investigations involving bonding defects such as:

  • voids

  • delamination

  • alignment errors

  • particle contamination

  • bond strength failures

• Work closely with FA laboratories and foundries to implement corrective actions.

• Drive continuous yield improvement initiatives using statistical methods and structured problem-solving tools.

• BS, MS, or PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Physics, MEMS, or a related technical discipline.

• 10 years of experience in new product introduction with ownership in wafer process integration, advanced packaging, CMOS manufacturing.

• Hands-on and product development expertise with one or more advanced wafer bonding technologies, including:

  • Fusion Bonding

  • Eutectic Bonding

  • Hybrid Bonding

  • Direct Bonding

• Experience with TSV integration, wafer thinning, cavity SOI, or 3D integration technologies.

• Experience supporting products through NPI and manufacturing ramp.

• Strong understanding of wafer-level process integration and manufacturing interactions.

• Experience working directly with semiconductor foundries or external manufacturing partners.

• Strong understanding of SPC, DOE, process characterization, yield improvement, and statistical analysis.

• Experience in MEMS, silicon photonics, advanced packaging, or heterogeneous integration.

• TSE experience supporting semiconductor customers or foundries.

• Familiarity with wafer-level metrology techniques including SEM, IR inspection, profilometry, C-SAM, AFM, or similar analytical tools.

• Experience leading cross-functional engineering efforts between design, manufacturing, and suppliers.

• Working knowledge of 8D, FMEA, Six Sigma, and structured root cause methodologies.

• Comfortable operating in a fast-paced startup environment where engineers have broad technical ownership.