Product Development Engineer (28nm)

Opportunity Summary

A rapidly growing semiconductor manufacturing organization is expanding its advanced-node capabilities and seeking a seasoned Product Development Engineer to support the industrialization of next‑generation analog and embedded technologies. This role offers the chance to guide the ramp of cutting‑edge process nodes, influence yield entitlement strategies, and collaborate closely with design, test, and operations teams to bring new products into high‑volume production.

You will play a pivotal part in optimizing performance across complex manufacturing flows, leveraging data‑driven approaches, and driving cross‑functional initiatives that strengthen product reliability, yield, and operational efficiency. This is a high‑impact opportunity for engineers who excel in solving technical challenges at scale and want to contribute to the long‑term evolution of advanced semiconductor platforms.

Key Responsibilities

• Lead yield‑improvement investigations by diagnosing root‑cause issues, implementing corrective actions, and driving continuous optimization across advanced-node products.
• Partner with design and business unit teams to support product characterization, qualification, and release into volume production.
• Provide hands‑on manufacturing support, addressing daily test, yield, and process‑related challenges across the production line.
• Initiate and execute improvement programs focused on productivity, cost efficiency, equipment performance, and overall product quality.
• Apply statistical analysis techniques and production datasets to guide engineering decisions and refine manufacturing and test strategies.
• Collaborate with design engineering to support simulation efforts, silicon validation, and product debug activities throughout the development cycle.
• Coordinate with cross‑functional product engineering groups to refine test methodologies, optimize hardware setups, and enhance diagnostic coverage.

Preferred Qualifications & Experience

• Direct experience working with 28nm or comparable advanced-node technologies.
• Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, or a related technical discipline (Master’s preferred).
• 5 years of semiconductor manufacturing, yield engineering, test engineering, or failure analysis experience (10 years preferred for senior-level consideration).
• Strong foundation in semiconductor device behavior, production testing, and diagnostic analysis methodologies.
• Proficiency in statistical tools (e.g., JMP or equivalent analytics platforms) and advanced data interrogation techniques.
• Experience with failure‑analysis tools such as emission microscopy, laser‑assisted fault isolation, waveform probing, or comparable methods.
• Background in digital, mixed‑signal, or analog IC design environments, including simulation, verification, ATPG, or scan‑based methodologies.
• Familiarity with memory architectures such as SRAM or Flash and understanding of process‑related yield behavior.
• Demonstrated ability to operate effectively in fast‑paced environments, manage competing priorities, and influence cross‑functional stakeholders.
• Strong communication, collaboration, and technical problem‑solving skills, with the ability to independently drive complex engineering initiatives.

What You’ll Get in Return

• Competitive compensation and comprehensive benefits.
• Opportunities for continuous technical development and career growth.
• A collaborative environment that values innovation, learning, and engineering excellence.
• Flexibility and support for maintaining work‑life balance.

Equal Opportunity Statement

This company is committed to fostering an inclusive and diverse workplace, prohibiting discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender identity, sexual orientation, or any other legally protected status.