What are the responsibilities and job description for the Senior Hardware/Embeddded Systems Engineer – Edge AI Device Manufacturing position at N2N Services Inc.?
Company Description
N2N Services Inc. empowers organizations of all sizes with secure, seamless AI and cloud integration through its flagship product, Helios, an Integration Platform as a Service (iPaaS). LightLeapAI enables turnkey SaaS-to-SaaS and SaaS-to-on-premise data integration, simplifying the creation, management, and security of APIs without the need for complex programming or infrastructure.
N2N focuses on helping enterprises adopt cloud- and AI-first strategies, enabling them to leverage real-time automation, artificial intelligence, and analytics to thrive in today’s competitive digital economy. With a commitment to making integration accessible, N2N helps businesses achieve digital transformation and operational efficiency.
Title: Senior Hardware / Embedded Systems Engineer — Edge AI Device (Prototype → Production)
About the role We've built and validated a working bench prototype of an edge AI appliance — an NVIDIA Jetson–based smart assistant with integrated vision, audio, and projection. We need a hardware engineer to take it from "works on the bench" to a manufacturable, certified product: board, power, RF, thermals, enclosure, and the path to first production units.
What you'll do
- Turn the existing prototype into a production hardware package: block diagram, schematic capture, PCB layout, BOM, electronics packaging, and/or electromechanical design.
- Integrate a compute module (NVIDIA Jetson Orin/Thor-class SoM) on a production carrier; spec a custom carrier and a consolidated power board at volume.
- Design the power system: USB-C PD (sink/trigger controllers), DC-DC buck rails, a class-D audio supply, star-grounding, and EMI mitigation; optionally, an isolated-mains variant for fixed installs.
- Own thermals for sustained compute load in a sealed metal enclosure used as a passive heat spreader.
- Solve RF in a metal chassis: integrated slot/aperture antennas (or coordinate an RF specialist), feed/impedance matching, and EM simulation validation.
- Drive the CNC aluminum enclosure design, tolerances, and DFM in partnership with mechanical and contract manufacturers.
- Lead the compliance path: FCC Part 15 B/C, CE (CISPR 32/35, RED), IEC/UL 62368-1, RoHS/WEEE — including pre-compliance scans and engaging a test lab.
- Recommend vendors and CMs; support bring-up, bench validation, and early production runs; document for handoff.
Required
- Demonstrated track record in taking electronic hardware from prototype to production.
- Strong schematic capture and PCB layout (Altium, KiCad, or equivalent), including carrier/baseboard design for compute modules.
- Power electronics: USB-C PD, multi-rail DC-DC, grounding/EMI design.
- Working knowledge of EMC/EMI and safety certification processes.
- Thermal design for compute-heavy embedded systems.
Strongly preferred
- NVIDIA Jetson / SoM ecosystem and embedded Linux.
- RF/antenna design (slot/aperture antennas in metal enclosures; HFSS/CST/OpenEMS) and FCC modular-grant experience.
- Mechanical/enclosure design (CNC aluminum, PEM hardware) or close partnership with an ME.
- Experience shipping consumer/enterprise devices with camera/mic/audio subsystems.