Engineer, Thermal Mechanical Simulation

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Thermal Mechanical Simulation Engineer you will be responsible for developing new and derivative process and product-level advanced HBM technologies driving Micron’s advantage by designing premier packages in the Advanced Packaging Technology and Development team. In this position, the engineer will be influencing Thermo-mechanical, thermal and fluid designs, finding efficient package structure and materials to mitigate any potential issues. The scope of the engineer’s work is to address all Thermo-mechanical, thermal and fluidic aspects of 2.5D and 3D advanced packaging development that is associated with design, material and process interactions. This position will collaborate with package architecture, fab/package assembly process integration and BU teams. Devices like HBM, advanced packaging, DDR RDIMM/LRDIMM modules, graphics packages, and other Micron architectures need thorough engineering analysis and invention to meet future mechanical requirements. Finite element analysis of package designs enables innovation and the development of outstanding solutions to help further our goals. Utilization of data science techniques and the application to our industry will make Micron more impactful and relevant. Key aspects of this role will be to Innovate, Influence, Collaborate, Partner and Implement. Responsibilities will include, but are not limited to: Support Advance Packaging development Team - Bonding & Packaging Design Maintain knowledge in semiconductor and general electronics packaging technologies such as High Bandwidth Memory (HBM), wafer-to-wafer bonding, Chip-On-Board (COB), Flip Chip, Through Silicon Vias (TSV), etc Detailed understanding of thermo compression bonding, wafer-to-wafer bonding process and the corresponding Multiphysics mechanisms involved to capture in the simulation. Knowledgeable with package design processes and guidelines Work with multi-functional global teams (namely Front-end design, product engineering, Technology development, Business unit, manufacturing and external programs) to fully understand and characterize manufacturing processes and packaging issues to enable simulation support with empirical validation Understanding of packaging materials and their production processes. Work with internal/external vendors and testing labs to design and implement effective testing procedures to characterize materials for simulation analysis Maintain an understanding of measurement methodologies and coordinate measurement data collection of packages and packaging materials for correlation and development of simulation activities Provide engineering analysis to support the development and direction of the packaging materials and technologies. Develop and apply advanced design and engineering analysis to Perform Simulations Use Engineering and Finite Element Analysis to support Assembly Packaging TD in the following areas: predictive analysis, design optimization, material/component testing design and hardware specifications, component Use advanced analysis techniques to develop innovative semiconductor packages and package systems using advanced design tools and thermal, mechanical, and electro-mechanical simulation applications such as ANSYS, Icepak, Flotherm and others as needed Improve material characterization and techniques Improve simulation capabilities and techniques Build simulation analysis reports using software such as Word, Excel, and PowerPoint to effectively communicate analysis results and conclusions. Effectively communicate simulation analysis reports to those needing the information to support efficient package build Use standard documentation and storage tools such as SharePoint, EDC and OneDrive for the accurate and timely upkeep of Design Simulation documentation About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more, please visit micron.com/careers All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_india@micron.com Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron. AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification. Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.