Principal Design Engineer, TSV Packaging

Work daily with multi-functional global teams (namely product design, product engineering, Technology development, Business unit, manufacturing and external customers to fully understand and characterize manufacturing processes and packaging design by simulation support Work with internal/external vendors and testing labs to design and implement effective testing procedures to characterize materials for simulation analysis 15 years working experience in Mechanical and thermo-mechanical finite element analysis, modeling and validation of electronic packages in Semiconductor industry or equivalent. Engineering tools: ANSYS Workbench, APDL, Abaqus, ProE, AutoCAD, Solid Works, MATLAB M.S. / Ph.D. in Mechanical Engineering, Material science, or related Engineering field. Simulation, modeling, and analysis of thermos-mechanical problems by multi-physics with software like Ansys, COMSOL, etc. Proven academic training and research experience in Solid and fluid mechanics Experience in performing fracture simulations for IC packages or equivalent cases in other mechanical engineering areas Experience in semiconductor process simulation like wafer-to-wafer bonding process, thermal compression bonding process, mass reflow process, die ejection process, etc. Ability to leverage the global team members and develop new characterization methods for new designs. Knowledge in product reliability tests like thermal cycling, and other environmental stresses. Mechanical design capability (2D, 3D) with SolidWorks, AutoCAD, etc. Good documentation/reporting skills and the ability to build and improve simulation and procedures for accurate and repeatable results. Data acquisition experience and numerical analysis proficiency in MATLAB, Excel, JMP, etc. is a plus Looking for a passionate, hardworking and self-motivated individual with the ability to handle multiple tasks, use good time management, while being a great teammate who is optimistic and responsible.