Principal Engineer - Packaging

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Job Description:

We are seeking a highly motivated and experienced Principal Packaging Engineer to join our NPI Packaging team. You will be a member of the FPGA (Field Programmable Gate Array) Business Unit, which is a leader in research, development, and manufacturing of highly reliable non-volatile Field Programmable Gate Arrays. In this role, the candidate will be responsible for advanced semiconductor package development. The ideal candidate will have a background in semiconductor packaging and assembly, and a strong ability to collaborate cross-functionally, solve technical problems, and manage projects.

Responsibilities

• Co-design packages with Silicon, Packaging, and Systems engineering teams to ensure designed packages meet electrical, mechanical and thermal requirements of high-performance flip chip packages.
• Work with business unit's IC design teams to select the optimum package solution on cost, performance, manufacturability, and reliability for new FPGA devices, satisfying business unit's roadmap for new products.
• Learn and define assembly BOM, process, troubleshoot, and support packaging issues of new advanced technology.
• Create package design documentation and assembly instructions.
• Participate in package technology development and/or other business productivity projects which have broad team impact (e.g. assembly process enhancement, new technology/structure development etc.)
• Manage package qualification for commercial and automotive applications.
• Coordinate with assembly vendors on new packages from development to high volume production.

Requirements/Qualifications:

• Bachelor's or Master's Degree in Electrical or Mechanical Engineering.
• Minimum of 10 years of professional experience, including at least 5 years focused on semiconductor IC packaging.
• Well versed with mid-range pin count packaging solutions, including but not limited to organic and ceramic flip chip BGA/LGA,WLCSP, wire bond BGA, and CSP.
• Strong understanding of materials as related to chip packaging interaction.
• Familiar with wafer BEOL (top metal, passivation, UBM, bumping etc.).
• Strong knowledge of advanced substrate manufacturing/process.
• Knowledgeable in JEDEC, AEC and IPC requirements for component and board level reliability qualification.
• Proven project management, communication, and leadership skills.
• Willingness and ability to grow expertise in multiple disciplines, including manufacturing/quality, materials, electrical, thermal, and mechanical engineering.
• Strong technical skills in resolving customer issues related to IC package quality and reliability
• Travel up to 10% is expected.

Preferred Qualifications

• Experience with Ansys Electronic Desktop
• Knowledgeable with failure analysis techniques on package technologies
• Experience with Cadence APD and AutoCad for custom substrate design.

Travel Time:

Physical Attributes:

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Pay Range:

Benefits of working at Microchip

Microchip Technology Inc is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected Veteran status, age, or any other characteristic protected by law.

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