Manufacturing Engineer III

Position Summary

Serves as the primary manufacturing process engineer for the MK21A REM program at the Oxnard microelectronics facility. Owns the development, qualification, and production readiness of all GaN hybrid module assembly processes including eutectic die attach, wire/ribbon bonding, hermetic sealing, and substrate bonding. Performs PMP engineering functions per the program’s Parts, Materials and Processes Control Plan (PMPCP). Drives NPI process development from first principles through production qualification.

Responsibilities

• Develop and qualify eutectic die attach (AuSn) processes for GaN-on-SiC power amplifier devices on CuW and silver-diamond carriers, including thermal profile optimization, void characterization, and scrub parameter development.
• Own the manufacturing process development lifecycle for TX and RX hybrid microelectronic modules: die attach, substrate attach, gold and aluminum wire bonding, ribbon bonding, and hermetic lid sealing (laser weld and epoxy seal).
• Perform PMP engineering functions: evaluate and approve bonding processes, solder alloys, epoxies (RTV 3145, silver epoxy 84-1LMIT, Stycast, Arathane 5750), conformal coatings, and substrate treatments for nuclear-qualified flight hardware.
• Develop and optimize MNS (Metal Nitride Silicon) thin-film capacitor bonding profiles for the TX C35 RCCA corrective action implementation.
• Drive resolution of feed-through soldering process (currently at 75% reject rate) and other heritage process yield issues.
• Author and maintain work instructions, process flow documents, routers, and DVT/qualification test procedures for all Oxnard-built module types across hardware variants (-229, -119, -109, -019P, -009, -007).
• Interface with design engineering (John Kitt, RF/TX Lead; Fred Schindler, RX Lead) to translate design intent into manufacturable processes. Bridge the gap between design engineering and the production floor.
• Support LM and DCMA reviews of manufacturing readiness, including GaN deep dive presentations, process capability demonstrations, and first-article inspection documentation.
• Evaluate and qualify outsourced manufacturing processes (Palomar die attach, potential Gold Naltos module assembly) in coordination with the Supplier Quality Engineer (Position 3).
• MK21A REM EMD — Oxnard Manufacturing Staffing Justification CUI // MERCURY INTERNAL — NOT FOR CUSTOMER DISTRIBUTION
• Guide manufacturing technicians and engineers on the production floor during first-article builds and engineering sample runs. Provide direct technical mentorship on NPI methodology.
• Support failure analysis and root cause investigations for manufacturing-related defects, applying materials science fundamentals (SEM/EDS, X-ray, CSAM, cross-section analysis) to identify failure mechanisms
  
  

Required Qualifications

• BS in Chemical Engineering, Materials Science, Mechanical Engineering, Electrical Engineering, or closely related engineering discipline. An engineering degree is required — this position develops processes from first principles, not from existing recipes.
• Typically requires 15 years in microelectronics packaging, hybrid microcircuit assembly, or semiconductor device packaging.
• Experience hands -on with at least 4 of the following: eutectic die attach (AuSn or AuGe), epoxy die attach, gold wire bonding, aluminum wire/ribbon bonding, hermetic seal processes (laser weld or seam weld), flip chip processes, substrate metallization/bonding, or MEMS/sensor packaging.
• GaN experience: Direct experience with GaN-on-SiC power device packaging strongly preferred. Understanding of thermal management challenges in high-power RF amplifier packaging (50V, 200W dissipation, Tj max 175°C) is essential.
• Experience transitioning microelectronic assemblies from R&D/prototype through LRIP to production. Must be able to articulate specific NPI programs led, including process qualification methodology, FMEA development, and production readiness assessment.
• Experience with MIL-PRF-38534 (hybrid microcircuits), MIL-STD-883, or equivalent military/space-grade manufacturing standards. Understanding of qualification flows, screening sequences, and lot acceptance testing.
• Experience in materials characterization (SEM/EDS, XPS/ESCA, CSAM, X-ray, cross-sectioning) for root cause analysis of packaging failures. Experience leading RCCA investigations.
• “This position requires you to have or obtain a government security clearance. Security clearances may only be granted to U.S. citizens.”
  
  

Preferred Qualifications

• MS or MBA in a relevant discipline.
• Experience at Lockheed Martin, Raytheon, Northrop Grumman, BAE, L3Harris, or Tier 1 defense microelectronics suppliers in a PMP or process engineering role.
• Experience with DOE methodology for process optimization (Taguchi, factorial, response surface).
• Knowledge of radiation-hardened component packaging and nuclear qualification processes (MIL-STD-11991A).
• Patent or publication record in microelectronics packaging (demonstrates first-principles capability).
  
  

"This position requires you to access information that is subject to U.S. export regulations. You may only access such information if you are a U.S. citizen, lawful permanent resident of the U.S., protected individual as defined by 8 U.S.C. 1324b(a)(3), or eligible to obtain the required authorizations from the U.S. government.

, Fulltime Equivalent Job Grade Salary Range for this position

• $75,000.00 - $150,000.00 annual salary for in-office or hybrid employees in FL, GA, IN, AZ, AL, MD or TX, and all remote employees
• $84,000.00 - $168,000.00 annual salary for in-office or hybrid employees in VA, CA, NH or MA
• $88,500.00 - $177,000.00 annual salary for in-office or hybrid employees in NJ
  
  
  
  

Why should you join Mercury Systems?

Mercury Systems is a technology company that makes the world a safer, more secure place. We push processing power to the tactical edge, making the latest commercial technologies profoundly more accessible for today's most challenging aerospace and defense missions. From silicon to system scale, Mercury enables customers to accelerate innovation and turn data into decision superiority. Headquartered in Andover, Massachusetts, Mercury employs more than 2,300 people in 24 locations worldwide. To learn more, visit mrcy.com

Our Culture

We are committed to making Mercury a great place to work, no matter where our employees are located. We offer a casual and enjoyable atmosphere that allows employees to learn and grow. We help and care for one another and work as one to achieve results for us and for our customers. We value communication and transparency, and strive to foster two-way dialogue at all levels of the organization. We are committed to lifelong learning, offering comprehensive skills training and tuition reimbursement. Whether you're just starting out on your career journey or you are an experienced professional, it's important to us that you feel recognized and rewarded for your contributions.

To find out more about Why Mercury?, or visit the Mercury Community or find answers to general questions at Mercury FAQs

Mercury Systems is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex (including pregnancy), sexual orientation, gender identity, national origin, genetic information, creed, citizenship, disability, protected veteran or marital status.

As an equal opportunity employer, Mercury Systems is committed to a diverse workforce. In order to ensure reasonable accommodation for individuals protected by Section 503 of the Rehabilitation Act of 1973, the Vietnam Veterans' Readjustment Act of 1974, and Title I of the Americans with Disabilities Act of 1990. If you would like to contact us regarding the accessibility of our website or need assistance completing the application process, please contact the number below.

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