RFIC Packing Engineer

MACOM designs and manufactures semiconductor products for Data Center, Telecommunication and Industrial and Defense applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe and Asia. MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard.

MACOM has more than 75 years of application expertise with multiple design centers, Si, GaAs and InP fabrication, manufacturing, assembly and test, and operational facilities throughout North America, Europe, and Asia. Click here to view our facilities. In addition, MACOM offers foundry services that represents a key core competency within our business.

MACOM sells and distributes products globally via a sales channel comprised of a direct field sales force, authorized sales representatives and leading industry distributors. Our sales team is trained across all of our products to give our customers insights into our entire portfolio.

RFIC Packaging Engineer

Technical lead for RFICpackage development, supporting NPI from concept through production release. This individual will provide direction to product and design engineers for optimum, cost effective packaging solutions as well as providing thermal design and analysis for IC package and system level physical designs. Package types include plastic molded leadframe packages, ceramic packages, laminate packages and metal packages for RF and Microwave IC’s. We are looking for an individual who has a proven track record of managing multiple product development programs in parallel and reducing to practice on schedule in a high volume manufacturing environment.

Responsibilities:

• Technical lead for RF/microwave plastic, ceramic, laminate and metal packages
• Work with internal product design, QA, Reliability, Failure Analysis, supply chain, and the external suppliers to develop and apply and qualify the appropriate packaging technologies and assembly processes, with focus on cost, high volume manufacturability, yield and quality
• Work with vendors and internal engineering resources to establish and update design rules for packaging
• Establish and implement robust assembly processes internally and at our contract manufacturers
• Troubleshoot IC packaging defects, then define and implement solutions
• Provide supplier benchmarking and tracking data to drive backend technology roadmap
• Working with Quality organization, characterize failure modes, and analyze as a function of packaging materials and processes
• Provide thermal modeling and application notes for new packages
  
  

Qualifications:

• MS or BS 3 years of experience in Materials Science, EE/ME with advanced IC package process development, design and thermal analysis with emphasis on RF and Microwave IC’s
• Proven track record of successfully driving package design/development activities from concept to implementation
• Experience working with high-volume contract manufacturers in developing processes or resolving technical issues
• Experience in package design and development including strong understanding of relationship between materials and package performance
• Deep knowledge of high-volume RFIC and Microwave IC assembly processes (die attach, flip chip, wafer saw, wire bond, surface mount, package singulation, etc.)
• Experience in failure analysis methodology
• Ability to work independently under tight deadlines, with strong ownership of projects
• Ability to work effectively in a multi-tasking mode
• Good written and verbal communication skills. Able to present ideas, design concepts, data and plans with high confidence at team meetings and executive review meetings
• Solid understanding and use of statistical techniques including DOE and SPC. Experience with JMP or Minitab
• Good teamwork skills in working together to achieve goals
• Knowledge of product characterization and reliability testing standards [JEDEC, IPC, EIA, RoHS, WEEE]
• Experience with Solidworks and ANSYS FEA is required.
• Experience with AutoCad is a plus.
• Experience with solving steady state and dynamic thermal and mechanical problems, using finite element analysis (FEA) software is required.
• Due to ITAR regulations, only candidates who are U.S. Persons (U.S. citizens, U.S. nationals, lawful permanent residents, or individuals granted asylum or refugee status) will be considered for this position.
  
  

The Salary Range for this position is $83,000 - $136000. Actual salary offered to candidates will depend on several factors, including but not limited to, work location, relevant candidates’ experience, education, and specific knowledge, skills, and abilities.

EEO:

MACOM is an Equal Opportunity Employer committed to a diverse workforce. MACOM will not discriminate against any worker or job applicant on the basis of race, color, religion, sex, gender identity, sexual orientation, national origin, age, disability, genetic information, veteran status, military service, marital status, or any other category protected under applicable law.

Reasonable Accommodation:

MACOM is committed to working with and providing reasonable accommodations to qualified individuals with physical and mental disabilities. If you have a disability and are in need of a reasonable accommodation with respect to any part of the application process please call 1-978-656-2500 or email HR_Ops@MACOM.com. Provide your name, phone number and the position title and location in which you are interested, and nature of accommodation needed, and we will get back to you. We also work with current employees who request or need reasonable accommodation in order to perform the essential functions of their jobs.

Benefits: This position offers a comprehensive benefits package including but not limited to:

• Health, dental, and vision insurance.
• Employer-sponsored 401(k) plan.
• Paid time off.
• Professional development opportunities.