What are the responsibilities and job description for the Electroplating Engineering Manager position at Lumicity?
Electroplate & Backend Engineering Manager | Thick Cu (Bump) Integration
Full-time | Semiconductor Manufacturing
We're partnering with a growing semiconductor manufacturer to hire a hands-on technical leader to own its backend thick Cu (bump) integration. This role has full visibility to the executive management team and real room to advance as the company scales.
What you'll do
- Serve as the technical authority in electroplating and lead R&D to expand current capabilities
- Lead dicing, etch, and solder ball attach efforts
- Drive manufacturing continuous improvement, using disciplined problem-solving and design of experiments
- Improve quality, yields, production rates, and efficiency while reducing costs and keeping systems safe and reliable
- Partner with external companies and universities on the latest integration advances
- Find root causes of failures using statistical methods and recommend changes to designs, tolerances, or processes
- Present to company executives and lead teams and projects
What you'll bring
- BS in Engineering
- 10 years in a semiconductor manufacturing environment, with solid knowledge of thick Cu (bump) integration
- Working knowledge of photolithography, electroplating, spin-on dielectrics, and laminate films
- People management or program leadership experience
- Strong written and verbal communication, and comfort working across all levels of an organization
- Adaptability in a fast-moving environment
Nice to have
- Experience taking processes from R&D to high-volume manufacturing
Eligibility: This role requires lawful access to ITAR/EAR-controlled information. Candidates must be a US Citizen, US Permanent Resident, or able to meet contract-specific licensure requirements.