Senior Application Engineer

Senior Applications Engineer - Advanced Thermal Solutions | $120 - 170k | Boston, MA

The Opportunity

We are looking for a driven Senior Applications Engineer to act as a key technical partner for customers evaluating and implementing advanced thermal interface material (TIM) technologies. This position is ideal for an engineer who enjoys combining customer interaction, technical problem-solving, and product validation in a fast-paced environment.

In this role, you will lead early- and mid-stage customer engagements, translate technical requirements into actionable engineering work, and provide the testing data, samples, and support needed for successful qualification and integration into advanced semiconductor packaging applications. You will collaborate with hyperscalers, ODMs, and OSATs while helping accelerate the adoption of next-generation thermal solutions for AI and data center infrastructure.

This is an opportunity to contribute to one of the semiconductor industry’s most important challenges: advanced thermal management.

Key Responsibilities

• Lead design and development activities to integrate liquid-metal thermal interface materials into customer-specific electronic packaging solutions.
• Develop and evaluate package and assembly mockups to validate design feasibility, including mechanical and reliability testing where required.
• Create and maintain detailed design documentation to support fabrication and customer coordination efforts.
• Manage fabrication activities internally and externally to align with customer timelines and project milestones.
• Partner with R&D teams to support ongoing product and system performance improvements.
• Serve as the primary technical contact for ODM, OSAT, and hyperscaler engineering teams throughout customer engagement cycles.
• Work alongside business development teams to identify and document customer technical requirements, including thermal budgets, assembly constraints, environmental conditions, geometric considerations, and reliability expectations.
• Prepare technical materials such as application notes, design guidelines, validation reports, and supporting documentation for customer qualification processes.
• Support customer testing and evaluation activities, troubleshoot technical challenges in real time, and coordinate solutions with internal engineering, manufacturing, and quality teams.
• Gather and communicate customer feedback to help shape future product development and technology roadmaps.

Qualifications & Experience

• Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or a related discipline.
• Hands-on experience with CAD modeling/drafting, prototyping, thermal and mechanical testing, data analysis, and technical reporting.
• Approximately 3–7 years of experience in semiconductor packaging, electronics assembly, thermal interface materials, or applications engineering within a technical B2B environment.
• Strong understanding of processor packaging and thermal system design, including cold plates, stiffener/lid design, and TIM1/TIM1.5/TIM2 selection, along with associated reliability testing methodologies such as uHAST, TCT, and HTS.
• Demonstrated ability to manage cross-functional technical projects and deliver customer-focused engineering solutions on schedule.
• Strong communication and presentation skills, with the ability to explain complex technical concepts to both technical and non-technical audiences.
• Experience working with elastomeric material design and fabrication is beneficial.
• Familiarity with thermal characterization tools and analysis methods such as C-SAM, X-ray inspection, thermal test platforms, or FEA simulation is advantageous.

Compensation & Benefits

• Competitive salary range: $120,000 – $170,000 annually
• Comprehensive health, dental, and vision coverage with significant employer contribution for employees and dependents
• Supplemental paid parental and family leave
• Unlimited paid time off
• 14 company holidays per year