Mechanical Packaging Engineer-Lunar Avionics

Mechanical Packaging Engineer-Lunar Avionics

KODA is a people-first company and a three-time Fortune Best Workplace®, Great Place to Work® certified, a Best Place for Working Parents®, and a six-time Huntsville Best Places to Work® winner.

We're a small business making a big impact on national-priority missions in missile defense, hypersonics, DoD space, and civil space. At KODA, you'll find:

• Competitive pay & great benefits
• Career growth & professional development
• A culture of trust, integrity, and teamwork

The name KODA, meaning "allies," reflects our commitment to our people, our customers, and our community. Join us and build a career that matters!

Position Overview:

KODA Technologies is seeking a Mechanical Packaging Engineer to support our customer's lunar avionics program. The engineer will design, document, and release flight avionics enclosures and related hardware, incorporating printed circuit boards (PCBs), interconnects, and associated structural and thermal features. All CAD work is performed exclusively in PTC Creo, and deliverables are peer reviewed prior to release.

This requisition covers three experience levels - Junior, Mid-Level, and Senior. Candidates will be evaluated and assigned to the appropriate level based on years of relevant experience, technical depth, and demonstrated ownership. Levels may be filled individually or in combination, depending on program needs.

Core Responsibilities:

Design Engineering Activities

• Incorporate printed circuit boards and interconnects into mechanical designs for lunar avionic products.
• Create 3D CAD models and assemblies, part and assembly drawings, installation drawings, and other required technical documentation for avionic enclosures, applying GD&T (GTOL) and industry drafting best practices.
• Collaborate with structural and thermal analysts to incorporate required design features (mounting interfaces, stiffening, thermal conduction paths, fastener patterns, etc.).
• Design assembly aids and test fixtures needed to support build and verification activities.
• Participate in mechanical design reviews and incorporate review comments into released hardware.

Design Engineering Deliverables (Avionics Enclosures)

• Produce and submit part drawings and models created exclusively in Creo, subject to peer review
• Produce and submit assembly drawings created exclusively in Creo, using a Model-Based Definition (MBD) template when requested, subject to peer review.
• Produce and submit additional avionics enclosure part or assembly drawings, which may include test and assembly fixtures and Interface Control Drawings (ICDs).
• Perform and submit tolerance stack analyses for avionics enclosure assemblies.
• Submit technical data required to initiate and inform procurement activities for parts (e.g., drawings, models, BOMs, material and finish callouts).

Require Qualifications:

• Bachelor's degree in Mechanical Engineering, Aerospace Engineering, or a closely related discipline (equivalent experience considered at Mid and Senior levels).
• Minimum 3 years of mechanical packaging / enclosure design experience (Junior); 6 years (Mid); 13 years (Senior). Target experience range across the three roles is 3 to 20 years.
• Hands-on proficiency with PTC Creo for parts, assemblies, and drawings.
• Working knowledge and application of GD&T per ASME Y14.5.
• Demonstrated experience producing peer-reviewed, release-quality mechanical drawings and data packages.
• Experience integrating PCBs, connectors, and harnesses into electronics enclosures.
• Ability to perform tolerance stack analyses on mechanical assemblies.
• Effective written and verbal communication; able to collaborate with multidisciplinary teams (electrical, structural, thermal, manufacturing, quality).

Desired Qualifications:

• Prior experience designing flight avionics enclosures for space, launch vehicle, satellite, missile, or defense applications.
• Experience with Model-Based Definition (MBD) workflows and templates in Creo.
• Familiarity with aerospace materials and finishes (aluminum alloys, CRES, anodize, alodine/chem film, conversion coatings, plating, thermal interface materials).
• Experience with environmental considerations relevant to lunar or space hardware (vacuum, thermal cycling, radiation, vibration, shock, outgassing - NASA-STD-6016 / ASTM E595).
• Familiarity with EMI/EMC packaging practices - grounding, bonding, and shielding.
• Experience working within a PLM/PDM environment (e.g., Windchill) and configuration-controlled release processes.
• Experience designing test fixtures for environmental testing (vibration, thermal-vacuum, shock).
• Working knowledge of DFM/DFA principles and interaction with machine shops, sheet-metal fabricators, and additive manufacturing suppliers.
• Prior experience supporting Blue Origin or equivalent prime contractor design standards and review processes.
• Senior level: demonstrated experience leading mechanical packaging scope through PDR/CDR and mentoring junior engineers.

Clearance & Access Requirements: U.S.Citizenship, and the ability to pass a background check

KODA Technologies Inc. provides equal employment opportunities to all employees and applicants for employment and prohibits discrimination and harassment of any type without regard to race, color, religion, age, sex, gender identity, sexual orientation, pregnancy, status as a parent, national origin, disability (physical or mental), family medical history or genetic information, political affiliation, military service, or other non-merit based factors. If you are unable to complete this application due to a disability, contact info@kodatech.com to ask for an accommodation or an alternative application process.