Sr. Spring Probe & Contact Development Engineer

Your Job

As a Senior Spring Probe & Contact Development Engineer, you will lead the design and development of advanced spring probes, stamped and formed contacts, and next‑generation contact technologies. This role serves as a technical authority, driving innovation, protecting intellectual property, and supporting engineering excellence across the organization.

Our Team

You will be part of a highly experienced engineering team focused on contact technologies and advanced product development. This group collaborates closely with manufacturing, product development, and cross‑functional partners to deliver innovative solutions for semiconductor and related high‑reliability industries.

What You Will Do

• Serve as a subject matter expert for spring probes, stamped and formed contacts, and emerging contact technologies
• Research and evaluate new materials, manufacturing methods, and technologies applicable to contact solutions
• Lead product development from initial concept through design, manufacturing, and customer evaluation
• Perform preliminary engineering analyses and simulations to validate new concepts
• Provide expert technical guidance and support to engineering teams and cross‑functional partners
• Develop and maintain engineering documentation, including design guidelines and best practices
• Train and mentor design and development engineers to strengthen technical capability across the organization
• Participate in task forces to address critical technical challenges and key customer or product issues
• Support intellectual property development through patent applications and technical disclosures
• Comply with and actively participate in all Environmental, Health, and Safety (EHS) programs and requirements
  
  
  

Who You Are (Basic Qualifications)

• Bachelor’s degree or higher in Engineering (Mechanical or Electrical preferred)
• Extensive experience (15 years) in spring probe technology, contact technologies, or related industries
• Strong foundation in engineering mechanics, physics, and manufacturing methods, including GD&T and ANSI/ASME standards
• Proficiency with SolidWorks, Microsoft Office, and comparable engineering design tools
• Ability to conduct and interpret engineering analyses and simulations (structural, thermal, signal integrity)
• Strong communication skills with the ability to convey complex technical concepts clearly
• Demonstrated ability to make sound technical decisions and exercise accurate judgment
• Willingness to travel up to approximately 20–25% as required
  
  
  

What Will Put You Ahead

• Deep experience within semiconductor or closely related industries
• Advanced expertise in Finite Element Analysis (structural, thermal, and fluid)
• Experience with Six Sigma methodologies, Failure Mode and Effects Analysis (FMEA), or similar tools
• Proven history of contributing to or leading patent development and IP protection efforts
• Strong self‑directed learning capability and passion for advancing contact technology innovation
• Experience presenting technical recommendations and strategic guidance to senior leadership
  
  
  

At Koch companies, we are entrepreneurs. This means we openly challenge the status quo, find new ways to create value and get rewarded for our individual contributions. Any compensation range provided for a role is an estimate determined by available market data. The actual amount may be higher or lower than the range provided considering each candidate's knowledge, skills, abilities, and geographic location. If you have questions, please speak to your recruiter about the flexibility and detail of our compensation philosophy

Hiring Philosophy

All Koch companies value diversity of thought, perspectives, aptitudes, experiences, and backgrounds. We are Military Ready and Second Chance employers. Learn more about our hiring philosophy here.

Who We Are

With a strong legacy of engineering excellence, Smiths Interconnect, a Molex company, is part of Molex’s Aerospace & Defense Solutions Division and represents the Signal Technologies business unit. Smiths Interconnect delivers mission‑critical connectivity solutions—including ruggedized connectors, cable assemblies, Fiber & RF, and high‑reliability technologies—designed to perform in the most demanding environments. From aerospace and defense to space, medical, and industrial applications, our innovative products enable reliability where it matters most. Join a passionate, global team helping shape the future of high‑reliability interconnect solutions.

At Koch, employees are empowered to do what they do best to make life better. Learn how our business philosophy helps employees unleash their potential while creating value for themselves and the company.

Our Benefits

Our goal is for each employee, and their families, to live fulfilling and healthy lives. We provide essential resources and support to build and maintain physical, financial, and emotional strength - focusing on overall wellbeing so you can focus on what matters most. Our benefits plan includes - medical, dental, vision, flexible spending and health savings accounts, life insurance, ADD, disability, retirement, paid vacation/time off, educational assistance, and may also include infertility assistance, paid parental leave and adoption assistance. Specific eligibility criteria is set by the applicable Summary Plan Description, policy or guideline and benefits may vary by geographic region. If you have questions on what benefits apply to you, please speak to your recruiter.

Additionally, everyone has individual work and personal needs. We seek to enable the best work environment that helps you and the business work together to produce superior results.

Equal Opportunities

Equal Opportunity Employer, including disability and protected veteran status. Except where prohibited by state law, some offers of employment are conditioned upon successfully passing a drug test. This employer uses E-Verify. Please click here for additional information. (For Illinois E-Verify information click here, aquí, or tu).