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IC Packaging Design Engineer

Judge Group, Inc.
Chandler, AZ Contractor
POSTED ON 8/31/2026
AVAILABLE BEFORE 9/30/2026
Location: Chandler, AZ Salary: Negotiable Description:
Job Description:

We are seeking experienced IC Packaging Design Engineers to support advanced semiconductor packaging programs. The ideal candidates will possess strong expertise in package and substrate design, with hands-on experience in leading package design tools and a deep understanding of performance, manufacturability, and reliability considerations.

Key Responsibilities
  • Develop and implement physical design and layout solutions for advanced IC packages.
  • Perform substrate design and package layout activities while ensuring adherence to design specifications.
  • Execute signal integrity (SI) and power integrity (PI) aware package designs.
  • Optimize package designs for performance, manufacturability, yield, reliability, and cost efficiency.
  • Ensure compliance with package design rules, technology constraints, and industry standards.
  • Collaborate with cross-functional teams including silicon, system, SI/PI, manufacturing, and reliability engineering teams.
  • Support design reviews, issue resolution, and continuous process improvements throughout the product development lifecycle.


Preferred Experience
  • Candidates should demonstrate expertise in one or more of the following areas:
  • Physical package design and layout.
  • Substrate design and routing methodologies.
  • SI/PI-aware package implementation.
  • Design for manufacturability (DFM), design for reliability (DFR), and yield optimization.
  • Package design rule verification and compliance.
  • Advanced semiconductor packaging technologies, including multi-die, SiP, or high-performance package solutions.


Qualifications
  • Bachelor's or Master's degree in Electrical or Electronics Engineering.
  • Senior-Level: 10 years of experience in IC packaging and package design.
  • Mid-Level: 4-6 years of experience with a Master's degree or 6 years with a Bachelor's degree in IC packaging and package design.
  • Strong communication skills and the ability to work effectively in a cross-functional engineering environment.


Required Technical Skills
  • Strong hands-on experience with Siemens (Mentor) Xpedition (XPD).
  • Alternative experience with Cadence Allegro, Advanced Package Designer (APD), or SiP tools is also acceptable.
Solid understanding of semiconductor packaging technologies, package architectures, and substrate design methodologies
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Contact:
This job and many more are available through The Judge Group. Please apply with us today!

Hourly Wage Estimation for IC Packaging Design Engineer in Chandler, AZ
$52.00 to $62.00
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