Senior Mechanical Engineer

Sr. Mechanical Engineer

Job Summary

• Lead and support mechanical packaging development of RF radios and equipment; design mechanical systems that seamlessly integrate PCBs, EMI shielding, connectors, harnessing, and user interfaces
• Develop CAD models and drawings for system components including: enclosures, radomes, PCBs, cabling and mounting brackets.
• Apply Design for Manufacturing (DFM), Design for Assembly (DFA), and Design for Test (DFT) principles to ensure cost-effective, scalable production.
• Perform mechanical stress, vibration, thermal and flow analyses as needed to validate designs and determine wind loading and drag coefficients.
• Conduct dimensional tolerance analyses on mechanical and thermal interfaces to deliver proper assembly fit and thermal performance.
• Provide hands-on support of prototype builds, component evaluations, and validation testing.
• Develop and maintain product documentation, Bill of Materials (BOMs) and assembly instructions.
• Support subcontractor or supplier activities related to design, manufacturing and component integration.

Basic Qualifications (Required Skills & Experience)

• Minimum 5 - 10 years of relevant experience in mechanical packaging for telecom, avionics, UAV/UAS, aerospace, or automotive electronic systems.
• Proficient with SolidWorks or equivalent for modeling of PCBs, electronics housings, and assemblies. Background in PCB mechanical design (sizing, panelizing, defining clearances, keep-outs, and fastening methods).
• Experience designing parts for machining, casting, thermoforming and additive manufacturing (3d printing).
• Experience with structural FEA, vibration, thermal and CFD flow analyses
• Hands-on experience supporting prototype builds, lab testing, and design validation.
• Excellent documentation, organization, time management, and communication skills
• Strong problem solving skills coupled with intellectual curiosity and a positive, can-do, team-oriented attitude

Preferred Qualifications

• Experience with thermal management designs for extreme environments; experience designing with heat pipes, vapor chambers, liquid cooling, various thermal interface materials
• Experience packaging electronics with EMI shielding features and considerations