Advanced Packaging Technologist

This role is part of the Jobright TNT - the private hiring network connecting top talent with top AI startups like Perplexity, Mercor, Cresta, Suno and 150 more.

This is not a mass job posting. Only select, high-signal candidates are invited to Jobright TNT and recommended directly to hiring teams

Hiring Company: MediaTek

One-liner: MediaTek is one of the world’s leading fabless semiconductor companies, building industry-leading SoCs that power smartphones, smart devices, automotive, and the next generation of edge AI computing.

Salary: $180K/yr - $272K/yr

Why Join Us:

• Generated over $19B in revenue in 2025, with flagship smartphone revenue growing over 40% YoY while powering 2B connected devices annually.

• Join one of MediaTek’s fastest-growing engineering teams, expected to double as the company accelerates its AI computing strategy.

• Play a key role in MediaTek’s transformation into an AI computing platform company, spanning flagship mobile, edge AI, AI PCs, automotive, and AI silicon.

• Solve some of the industry’s toughest hardware-software co-design challenges for next-generation AI computing and flagship mobile platforms.

Role Responsibilities

• Collaborate with internal teams, external customers, and key partners to develop advanced packaging solutions from concept to mass production

• Coordinate with package design, substrate, and assembly partners to select materials and BOM, ensuring manufacturability and meeting electrical, mechanical, thermal, and system-level requirements

• Lead and coordinate projects across design, engineering, supply chain, manufacturing, and quality assurance to ensure successful execution

• Establish and maintain strong relationships with suppliers, customers, and internal teams to meet project requirements and resolve supply chain or manufacturing issues

• Monitor and report on project progress, supply chain performance, and manufacturing metrics to senior management

Qualifications

Required

• Expertise in 2.5D/3D package architecture and advanced packaging technologies such as CoWoS, EMIB, SoIC, CoW, WoW, POP, etc

• Working knowledge of package design, electrical signal integrity, power integrity, thermal, and thermomechanical principles, with a fundamental understanding of 2.5D/3D package challenges

• Experience with wafer level processes, package assembly processes, and substrate technology

• Strong supply chain and quality management skills, including BOM management, procurement, logistics, and inventory

• Understanding of legacy packaging technologies, package failure mechanisms, and quick problem-solving skills

• Ability to develop and maintain strong relationships with key enablement partners and customers, ensuring smooth communication and alignment on project requirements, product quality, reliability, system, and operational needs

• Excellent communication skills

• 10-15% international travel required

How can I join Jobright TNT:

If this is your first time applying to a Jobright TNT role, the process works as follows:

1. Apply to your first Jobright TNT role

2. We review your background to determine if you meet the TNT quality bar

3. If qualified, your application is directly recommended to the employer

4. Once accepted into TNT, you may be:

- Invited to apply for other exclusive TNT-only roles

- Invited to private, invite-only hiring events with top startups

You will be notified of your TNT selection result.

PS: All Jobright TNT roles are 100% real, directly hired by top AI startups we partner with, and come with priority review and higher response rates than the normal application queue.