What are the responsibilities and job description for the HBI Module Development Engineer position at Intel?
Job Details
Job Description:
The Role and Impact
As a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in advanced packaging for high-performance computing, AI, and chiplet architectures.
You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both first-of-a-kind (FOK) platform development and optimization of manufacturing processes to support development and high-volume manufacturing environments.
Your work will directly impact module-level performance, yield, reliability, and operational efficiency while helping shape Intel's future hybrid bonding technology roadmap.
Key Responsibilities
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Minimum Qualifications
Experienced Hire
Shift
Shift 1 (United States of America)
Primary Location:
US, Oregon, Hillsboro
Additional Locations:
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $155,520.00 - 298,440.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
Job Description:
The Role and Impact
As a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in advanced packaging for high-performance computing, AI, and chiplet architectures.
You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both first-of-a-kind (FOK) platform development and optimization of manufacturing processes to support development and high-volume manufacturing environments.
Your work will directly impact module-level performance, yield, reliability, and operational efficiency while helping shape Intel's future hybrid bonding technology roadmap.
Key Responsibilities
- Drive process and/or equipment manufacturing development for die-to-wafer hybrid bonding, including parameter optimization, equipment characterization, and process control.
- Develop and optimize manufacturing processes to improve yield, reliability, and defectivity performance.
- Improve bond interface quality, alignment performance, overlay accuracy, surface preparation, and contamination control.
- Design and execute DOE-based experiments and perform statistical analysis to establish robust process windows and control strategies.
- Lead first-of-a-kind (FOK) process and equipment capability development for new bonding platforms and technologies.
- Identify and implement process and equipment improvements to enhance manufacturing capability, efficiency, and output.
- Conduct process feasibility studies using characterization, modeling, simulation, and experimental methodologies.
- Partner with equipment suppliers and materials vendors to develop enabling process and hardware solutions.
- Collaborate with technology development, process integration, and manufacturing organizations to drive process maturity and continuous improvement.
- Contribute to future technology roadmaps through evaluation of emerging hybrid bonding technologies.
- Demonstrated ability to solve complex technical problems using structured engineering methodologies.
- Strong written and verbal communication skills with the ability to present technical findings to diverse audiences.
- Ability to influence and collaborate across cross-functional teams in technology development and manufacturing environments.
- Proven ability to mentor and develop engineers and technical team members.
- Demonstrated ability to manage multiple priorities and drive results in a fast-paced environment.
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Minimum Qualifications
- Bachelor's degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering/scientific field and 9 years of industry experience; OR
- Master's degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering/scientific field and 6 years of industry experience; OR
- PhD in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering/scientific field and 5 years of industry experience.
- 5 years of industry experience in hybrid bonding, wafer bonding, advanced packaging,
- Experience leading first-of-a-kind (FOK) process or equipment development programs.
- Experience introducing new hybrid bonding platforms, manufacturing capabilities, or advanced packaging technologies.
- Knowledge of bond interface defect mechanisms, including void formation, adhesion challenges, contamination effects, and material interactions.
- Experience with alignment-sensitive manufacturing processes and overlay performance optimization.
- Experience with process characterization, metrology, defect inspection, or failure analysis techniques.
- Experience improving equipment capability, throughput, utilization, or process performance in a manufacturing environment.
- Experience collaborating with external equipment suppliers and materials vendors on technology development activities.
- Experience supporting technology transfer from development to manufacturing.
Experienced Hire
Shift
Shift 1 (United States of America)
Primary Location:
US, Oregon, Hillsboro
Additional Locations:
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $155,520.00 - 298,440.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
Salary : $155,520 - $298,440