What are the responsibilities and job description for the Advanced Packaging Module Development Engineer position at Intel?
Job Details
Job Description:
The Role and Impact
Join Intel's Advanced Packaging Technology Development team as an Advanced Packaging Research and Development Engineer where you will drive innovation and help shape the future of advanced IC packaging solutions. In this role, you will play a critical part in optimizing processes and equipment to meet Intel's ambitious roadmap for assembly packaging platform technologies.
In this role, you will be responsible for process and equipment development at the module level, driving solutions that meet Intel’s stringent requirements for quality, reliability, yield, cost, and productivity. You will apply a strong understanding of process characterization, equipment capability, and statistical methodologies to enable manufacturability aligned with Intel’s advanced packaging roadmap.
Working within a highly cross-functional, world-class engineering team, you will help solve complex technical challenges, introduce innovative process improvements, and ensure Intel remains a technology leader in advanced packaging.
Responsibilities
Key Responsibilities will include but are not limited to:
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Note
This position is not eligible for Intel immigration sponsorship.
Minimum Qualifications And Experience
Candidate must meet one of the following:
Must possess a Bachelor's degree in Mechanical Engineering, Chemical Engineering, Manufacturing or Process Engineering, Materials Science, Physics, Chemistry, or a closely related field.
Additionally, candidate must have 4 years of experience in the following:
Take the next step in your engineering career by contributing to Intel’s mission to deliver innovative, reliable, and manufacturable packaging solutions that power the next generation of semiconductor technology.
Job Type
Experienced Hire
Shift
Shift 1 (United States of America)
Primary Location:
US, Arizona, Phoenix
Additional Locations:
Business Group
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $133,800.00 - 188,890.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
Job Description:
The Role and Impact
Join Intel's Advanced Packaging Technology Development team as an Advanced Packaging Research and Development Engineer where you will drive innovation and help shape the future of advanced IC packaging solutions. In this role, you will play a critical part in optimizing processes and equipment to meet Intel's ambitious roadmap for assembly packaging platform technologies.
In this role, you will be responsible for process and equipment development at the module level, driving solutions that meet Intel’s stringent requirements for quality, reliability, yield, cost, and productivity. You will apply a strong understanding of process characterization, equipment capability, and statistical methodologies to enable manufacturability aligned with Intel’s advanced packaging roadmap.
Working within a highly cross-functional, world-class engineering team, you will help solve complex technical challenges, introduce innovative process improvements, and ensure Intel remains a technology leader in advanced packaging.
Responsibilities
Key Responsibilities will include but are not limited to:
- Develop and optimize panel level processes and equipment to support Intel's advanced packaging technologies.
- Establish process specifications and equipment configurations for new technologies and integrate these into production workflows.
- Apply principles of design of experiments (DoE) to characterize process windows and understand interactions between equipment, materials, and processes.
- Drive continuous improvements in process capability, quality, reliability, cost, and yield while enhancing automation and productivity.
- Collaborate with cross-functional teams to identify and mitigate risks in packaging technology development and ensure milestone achievement.
- Lead efforts to innovate and improve equipment and processes using statistical methods and experimental design.
- Document process improvements and advancements through technical white papers and data analysis reports.
- Engage with internal and external stakeholders to address packaging challenges and deliver solutions aligned with Intel's goals.
- Demonstrates strong ownership and accountability for technical deliverables.
- Applies a data-driven, structured approach to problem solving and decision-making.
- Thrives in collaborative, cross-functional environments.
- Communicates technical information clearly and effectively.
- Adaptable and comfortable working in fast-paced, evolving development settings.
- Driven by continuous learning and process improvement.
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Note
This position is not eligible for Intel immigration sponsorship.
Minimum Qualifications And Experience
Candidate must meet one of the following:
Must possess a Bachelor's degree in Mechanical Engineering, Chemical Engineering, Manufacturing or Process Engineering, Materials Science, Physics, Chemistry, or a closely related field.
Additionally, candidate must have 4 years of experience in the following:
- Experience with process development, equipment adjustment, and manufacturing process control.
- Design of experiments (DoE) principles and statistical data analysis.
- Experience in process characterization and statistical process control methodologies.
- Analytical skills and experience troubleshooting integrated technology issues.
- Experience with materials testing and characterization techniques such as DSC, TGA, D/TMA, ICPMS, FTIR, or SEM.
- Master's degree with 3 years or PhD degree with 0 years of experience in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, or a closely related field.
- Proficiency in statistical tools, Microsoft Office software suite applications, and process control software/frameworks.
- Experience working with organic and inorganic materials in packaging processes.
- Previous related work experience in a semiconductor foundry preferred.
Take the next step in your engineering career by contributing to Intel’s mission to deliver innovative, reliable, and manufacturable packaging solutions that power the next generation of semiconductor technology.
Job Type
Experienced Hire
Shift
Shift 1 (United States of America)
Primary Location:
US, Arizona, Phoenix
Additional Locations:
Business Group
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $133,800.00 - 188,890.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
Salary : $133,800 - $188,890