What are the responsibilities and job description for the Operator - Die Attach/Flip Chip position at Integra Technologies Silicon Valley, LLC?
POSITION DESCRIPTION
Position Title: Production Operator/Die Attach
Reports To: Production Manager
Department Name: Mfg – Die Attach/Flip Chip
Location: Silicon Valley
FLSA Status: Non-Exempt
POSITION SUMMARY
Perform automatic and manual die bonding with various equipment that bonds integrated circuit dies to substrates, lead frames and package cavity.
KEY RESPONSIBILITIES/ESSENTIAL FUNCTIONS INCLUDE
- Set-up and operate automatic/manual Die Attach, Flip Chip and Dispenses equipment.
- Operate a variety of equipment, including high-powered microscopes, with speed and accuracy.
- Follow job traveler instructions accurately.
- Identify and report process deviations to supervisor.
- Meet quality goals, safety requirements, and follow company policies.
- Flexibility to perform other duties as assigned.
JOB REQUIREMENTS INCLUDE
Education: High School diploma or above
Experience:
- 6 months of semiconductor assembly in a Production environment preferred
- Experience in second optical inspection may be applicable
Knowledge/Skills:
-
Experience with:
- Manual Die Attach operation, Microscope and manual Dispense equipment (EFD, etc..).
- Manual Dam & Fill operation and automatic equipment (Asymtek, etc…)
- Automatic Die Attach bonders (Datacon, MAT6400, etc…)
- Semi-automatic Flip Chip bonders (SEC860, etc..)
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