BGA Rework Assembler

Job Title: BGA Repair Assembler
Location: San Jose, CA
Job Type: Contract to hire
Shift Type: Day Shift (8AM to 4:30PM)

Job Purpose:
Performs specialized, high-precision electronics rework and micro-soldering repairs on complex Printed Circuit Board Assemblies (PCBAs). Operates split-vision optical alignment rework stations and automated X-ray inspection equipment to remove, replace, and reflow BGA and fine-pitch SMT components.

Key Responsibilities:

• Perform BGA, micro-BGA, QFN, and fine-pitch SMT rework using hot-air or infrared rework stations.
• Clean PCB pads, perform BGA reballing, and prepare circuit board sites.
• Execute micro-soldering repairs on damaged pads, traces, and PCB layers under a microscope.
• Operate and interpret Automated X-ray Inspection (AXI) equipment.
• Program and modify thermal profiles for lead-free and leaded assemblies.
• Ensure compliance with IPC-A-610 and IPC-7711/7721 standards.
• Document repair activities and component traceability in the Manufacturing Execution System (MES).

Qualifications:

• 2–4 years of hands-on experience in SMT repair and BGA rework.
• Minimum 1 year of experience operating Air-Vac DRS or similar split-vision BGA rework systems.
• IPC-A-610 and IPC-7711/7721 certification preferred.
• Experience with X-ray inspection equipment and schematic/blueprint interpretation.
• Ability to work under a microscope with excellent manual dexterity.
• Knowledge of ESD procedures and safe handling of electronics, chemicals, fluxes, and solvents.
• Ability to lift up to 25 lbs. and stand or sit for extended periods.