Sr Photolithography Process Development Engineer

SUMMARY:

Under the direction of the Director of Photolithography Development Engineering, the Sr. Photolithography Development Engineer is responsible for the developing and implementing new photolithography processes for next generation magnetic recording heads, including implementing new photolithography processes which ensure product manufacturability; designs and conducts experiments, analyzes data, and presents findings; researches, selects, and qualifies new tools which improve efficiency and yield. This position is located in Milpitas, California.

ESSENTIAL FUNCTIONS:

• Develops and implements new photolithography processes for next generation magnetic recording heads
• Implements new process control schemes or methodologies which ensure product manufacturability
• Designs and conducts experiments, analyzes data, and develops recommendations for improving performance and yield while reducing scrap
• Adheres to appropriate timeline for introducing new processes into the manufacturing line
• Partners with other groups and departments, including process and product engineering to develop and deliver products and programs
• Oversees the work of the Process Technicians to ensure accurate process execution and efficient wafer disposition
• Adheres to all safety policies and procedures as required
• Performs other duties of a similar nature or level*

MINIMUM QUALIFICATIONS:

• Master’s degree in Materials Science, Physics, or Electrical Engineering and/or equivalent relevant experience; PhD preferred
• Three of experience working in the magnetic recording head, hard disk drive, or semiconductor industry in photolithography process development
• Experience working in a wafer fab manufacturing environment
• Experience with Statistical Process Control (SPC)
• Proficient in the use of Microsoft Office Applications

­­Knowledge, Skills, and Abilities:

• Knowledge of semiconductor or HDD industry principles, practices, and techniques
• Knowledge of wafer fabrication processing techniques, including process development and integration practices
• Knowledge of TMR and PMR processes and applications
• Knowledge of wafer manufacturing principles, processes, and equipment
• Knowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations
• Knowledge and ability to use Statistical Process Control (SPC) to analyze data, create reports, present findings, and recommend appropriate action
• Able to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management
• Able to work productively and collaboratively with all levels of employees and management
• Able to comply with all safety policies and procedures
• Demonstrated organizational and time management skills
• Demonstrated problem-solving and trouble shooting skills
• Flexible and able to prioritize

The annual rate for this full-time position is between $130,000.00-180,000.00 bonus target benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual pay range shown is subject to change and may be modified periodically.