Technical Solutions Manager – Data Center Liquid Cooling

1.Location: Silicon Valley, California

2. About Han’s Laser：

Han’s Laser is a publicly traded global technology group and a leading provider of intelligent manufacturing equipment and integrated technology solutions.

We employ more than 20,000 people worldwide, including over 6,600 R&D professionals, and hold more than 7,400 patents. Our global network serves more than 40,000 industrial customers across 100 countries and regions.

In 2025, Han’s Laser generated approximately US$2.67 billion in annual revenue. In 2026, the Group’s market capitalization surpassed US$15 billion. We are now expanding our technology portfolio and market presence in AI data center thermal management.

3.The Opportunity：

We are seeking an experienced Technical Solutions Manager to serve as the technical bridge between North American customers and our global R&D, product, and engineering teams.

You will be the regional technical expert for our data center liquid cooling portfolio, leading customer discovery, solution design, technical pre-sales, and product localization. You will help customers develop reliable and scalable cooling architectures for high-density AI and HPC environments while ensuring alignment with North American technical and compliance requirements.

4.Key Responsibilities：

• Lead technical discovery, customer workshops, and pre-sales engagements for data center liquid cooling and high-density thermal management solutions.
• Develop technical proposals, system architectures, equipment selections, sizing calculations, and TCO/ROI analyses for CDU, direct-to-chip cold-plate, RDHx, chiller, and heat-rejection deployments.
• Review and develop P&IDs, hydraulic designs, pump and valve configurations, control sequences, redundancy strategies, and primary/secondary cooling-loop integration.
• Advise customers on integrating liquid cooling systems with existing facility infrastructure and traditional air-cooling systems, including CRAC and CRAH equipment.
• Serve as the Voice of the Customer in North America, translating technical requirements and market feedback into actionable product specifications for global R&D and product teams.
• Support product localization and compliance with applicable UL/CSA requirements, ASHRAE TC 9.9 guidance, OCP specifications, and customer-specific standards.
• Support proof-of-concept projects, technical validation, design reviews, pilot deployments, and project handover to delivery and service teams.
• Provide technical training and solution support to regional sales teams, channel partners, consultants, and customers.

5. Qualifications：

• Bachelor’s degree in Mechanical Engineering, Thermal Engineering, Electrical Engineering, or a related technical field; a master’s degree is preferred.
• 5 years of experience in solutions engineering, applications engineering, technical pre-sales, product management, or thermal engineering within the data center, mission-critical cooling, HVAC, or IT hardware industry.
• Strong technical knowledge of CDUs, direct-to-chip cold plates, RDHx, chillers, heat-rejection systems, and liquid cooling distribution architecture.
• Working knowledge of CRAC, CRAH, chilled-water systems, and hybrid air-and-liquid cooling environments.
• Experience reviewing or developing P&IDs, hydraulic calculations, piping and valve configurations, control sequences, and system redundancy designs such as N, N 1, and 2N.
• Understanding of coolant selection, water quality, material compatibility, leak detection, controls, and monitoring requirements.
• Ability to translate complex technical concepts into clear customer recommendations and business value.
• Strong presentation, technical writing, problem-solving, and cross-functional collaboration skills.
• Ability to work effectively with global teams across multiple cultures and time zones.
• Willingness to travel across North America as required

Preferred Experience

• Experience designing or supporting liquid cooling solutions for AI, HPC, hyperscale, or high-density data center environments.
• Experience at—or working closely with—companies such as Vertiv, nVent, Schneider Electric / Motivair, Eaton / Boyd Thermal, STULZ, AIRSYS, or comparable thermal management organizations.
• Thermal engineering or infrastructure experience with companies such as NVIDIA, AMD, Intel, Lenovo, Dell, HPE, Supermicro, or other leading semiconductor and server technology providers.
• Familiarity with applicable UL/CSA certification processes, ASHRAE TC 9.9 guidance, and Open Compute Project specifications.
• Experience with CFD, thermal modeling, hydraulic sizing, or other engineering design and simulation tools.
• Experience supporting product localization, new product introduction, or market entry in North America.

6.Why Join Us？

• Serve as a key technical leader in the North American expansion of our data center liquid cooling business.
• Influence product localization and technology development based on direct customer and market feedback.
• Work closely with global R&D, product, engineering, and commercial teams.
• Contribute to next-generation cooling solutions for rapidly growing AI and high-density computing environments.

7.Total Target Compensation: $200,000–$250,000 per year, including base salary, performance-based incentives, and an annual bonus.For exceptionally qualified candidates with highly relevant industry expertise and established customer relationships, a higher compensation package may be considered.