What are the responsibilities and job description for the Thermal Engineering Intern position at Futurewei Technologies, Inc.?
Description
Futurewei has opening for Thermal Engineer intern. Candidates will participate in cutting edge research in next-generation electronic devices and packages. This role focuses on heat transfer challenges in high-power and high-density electronics. The intern will have the opportunity to work alongside and learn from senior researchers to explore and develop new and impactful technologies.
Responsibilities
All qualified applicants will receive consideration for employment without regard to race, color, gender, sexual orientation, gender identity or expression, religion, national origin, marital status, age, disability, veteran status, genetic information, or any other protected status under federal, state, and local laws.
Futurewei has opening for Thermal Engineer intern. Candidates will participate in cutting edge research in next-generation electronic devices and packages. This role focuses on heat transfer challenges in high-power and high-density electronics. The intern will have the opportunity to work alongside and learn from senior researchers to explore and develop new and impactful technologies.
Responsibilities
- Perform electronic package and system level thermal analysis.
- Design, develop, test innovative system-level cooling solutions.
- Analyze heat dissipation, temperature distribution, and thermal resistance in device structures, including interfaces and thin films.
- Assist in modeling thermal boundary conductance (TBC) and interfacial heat transport in heterogeneous material systems.
- Provide research input on early explorations: determine the scope of the problem, the best use of ML, and the merits of different approaches.
- Integrating latest research into applied projects.
- Prepare reports, manuscripts, proposals, and technical manuals for use by other scientists.
- Master’s degree, Ph.D. or Ph.D. candidate in Mechanical Engineering, Materials Science, Electrical Engineering, or a related field.
- Fundamental knowledge of nanoscale heat transfer and interfacial thermal transport concepts.
- Experience in performing thermal simulation.
- Experience in the thermal/mechanical design of electronic devices.
- Self-motivated detail-oriented team player.
- Good verbal and written communication skills. Have track record of publishing scientific papers.
All qualified applicants will receive consideration for employment without regard to race, color, gender, sexual orientation, gender identity or expression, religion, national origin, marital status, age, disability, veteran status, genetic information, or any other protected status under federal, state, and local laws.