What are the responsibilities and job description for the Thermal/Mechanical Field Application Engineer position at Foxconn-PCE Technology?
Job Title: Thermal/Mechanical Field Application Engineer
FSLA Status (Exempt or Non-exempt): Exempt
Location (City, State): Seattle, WA
Reports To: Sr. Account Manager
Direct Reports (Yes, No): No
Company Overview:
Established in Taiwan in 1974, Hon Hai Technology Group, commonly known as Foxconn, is the world’s largest electronics manufacturer and leading provider of technological solutions with a network of over 200 campuses across 24 countries. In the US, Foxconn employs 6,500 across 40 different sites with manufacturing operations in Virginia, Wisconsin, Ohio, Indiana, Texas and California. As of 2023, Foxconn ranks 32nd among the Fortune Global 500 and reported a revenue of approximately USD $213 billion in 2024.
The company’s diverse product offerings span four major segments: smart consumer electronics, cloud and networking solutions, computing and various other components. Foxconn makes 40% of the consumer electronics that we find in our everyday lives. In recent years, Hon Hai has adopted the 3 3 strategy, focusing on three emerging industries - electric vehicles, digital health solutions, and robotics - while leveraging three key technologies: next-generation communications, artificial intelligence (AI), and semiconductors. Together these initiatives position the company as a leader for innovation in the 21st century.
Hon Hai Technology Group is deeply committed to championing environmental sustainability within its manufacturing processes. By integrating sustainability into its operations framework, the company strives to serve as a best-practice model for global enterprises, enhancing corporate responsibility while meeting the growing demand for environmentally conscious productions methods.
Job Summary:
- The primary function of the Thermal/Mechanical Field Application Engineer is to provide technical support for customer design and engineering teams, support integration and application of the company’s products in customer environments. This role acts as a bridge between R&D and client-facing functions to support successful product design, deployment, and ongoing performance.
Duties and Responsibilities:
- Provide application and product-level support to clients, including AWS, Microsoft, Meta, and other partners in the Greater Seattle area.
- Collaborate with customer engineering teams on integration, debugging, and performance optimization.
- Translate client technical requirements to internal R&D teams.
- Deliver product training, demos, and documentation to customers.
- Act as primary technical point of contact during pre-sales, evaluation, and post-deployment phases.
- Analyze and resolve field issues and recommend solutions.
- Create field reports, support documentation, and provide feedback for continuous improvement.
- Determine customer requirements (both explicit and implicit) and accurately communicate them back to key engineering team members.
- Drive product design development incorporating design rules, performance optimization and manufacturing for HVM (high volume manufacturing).
- Ability to manage multiple customer opportunities simultaneously and prioritizing actions appropriately.
- Must understand customer design cycles to drive our product design-in opportunities.
- Leverage extensive personal experience in thermal/mechanical/electrical design and material science to become a trusted partner for our customers.
- Will support all required rework in US & Mexico if required. Travel US Domestic, Mexico & Asia as needed.
- Traveling with our commercial team, the Field Application Engineer will be the primary customer interface for all technical discussions.
- Perform other duties as requested or assigned.
Education:
- Bachelor’s degree in mechanical or thermal engineering, or related field.
Experience:
- Minimum 3–5 years of relevant experience as thermal applications engineer, mechanical engineer or related in field applications, systems integration, or embedded systems.
- Any liquid cooling solutions experience is preferred.
Other Requirements:
- Excellent communication skills and interpersonal skills.
- Fluency in Mandarin required.
- The role regularly communicates with customers, suppliers, or teams who speak only that language.
- The role requires reading technical documents, safety instructions, or specifications written only in that language.
- The role provides support to foreign stakeholders, leadership, or business units who exclusively use that language.
- Self-motivated personality.
EEOC Statement
Foxconn is an equal opportunity employer that is committed to diversity and inclusion in the workplace. Foxconn prohibits discrimination and harassment of any kind and provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, gender, religion, sex, sexual orientation, ethnicity or national origin, age, disability, marital status, genetics, pregnancy, or any other protected characteristic as outlined by federal law. In addition to federal law requirements, Foxconn complies with applicable state and local laws governing nondiscrimination in employment in every location in which the company has facilities. This policy applies to all terms and conditions of employment, including recruiting, hiring, placement, promotion, termination, layoff, recall, and transfer, leaves of absence, compensation, and training.