What are the responsibilities and job description for the Thermo-Mechanical, CFD Simulation Engineering Intern position at Etched?
About Etched
Etched is building the world’s first AI inference system purpose-built for transformers - delivering over 10x higher performance and dramatically lower cost and latency than a B200. With Etched ASICs, you can build products that would be impossible with GPUs, like real-time video generation models and extremely deep & parallel chain-of-thought reasoning agents. Backed by hundreds of millions from top-tier investors and staffed by leading engineers, Etched is redefining the infrastructure layer for the fastest growing industry in history.
Job Summary
We are seeking a talented Thermo-Mechanical, CFD Simulation Engineering Intern focused on Chip-on-Wafer-on-Substrate (CoWoS) package development to join our Advanced IC Packaging Team. You'll use tools like ANSYS Mechanical APDL and ANSYS FLUENT to perform critical thermo-mechanical/CFD analysis and contribute to next-generation high-performance computing systems.
Key Responsibilities
Program details
How We’re Different
Etched believes in the Bitter Lesson. We think most of the progress in the AI field has come from using more FLOPs to train and run models, and the best way to get more FLOPs is to build model-specific hardware. Larger and larger training runs encourage companies to consolidate around fewer model architectures, which creates a market for single-model ASICs.
We are a fully in-person team in West San Jose, and greatly value engineering skills. We do not have boundaries between engineering and research, and we expect all of our technical staff to contribute to both as needed.
Etched is building the world’s first AI inference system purpose-built for transformers - delivering over 10x higher performance and dramatically lower cost and latency than a B200. With Etched ASICs, you can build products that would be impossible with GPUs, like real-time video generation models and extremely deep & parallel chain-of-thought reasoning agents. Backed by hundreds of millions from top-tier investors and staffed by leading engineers, Etched is redefining the infrastructure layer for the fastest growing industry in history.
Job Summary
We are seeking a talented Thermo-Mechanical, CFD Simulation Engineering Intern focused on Chip-on-Wafer-on-Substrate (CoWoS) package development to join our Advanced IC Packaging Team. You'll use tools like ANSYS Mechanical APDL and ANSYS FLUENT to perform critical thermo-mechanical/CFD analysis and contribute to next-generation high-performance computing systems.
Key Responsibilities
- Develop FEA models for CoWoS-based IC packages using ANSYS Mechanical APDL
- Perform thermo-mechanical stress/strain analysis and thermal cycling simulations
- Analyze package warpage, solder joint reliability, and interconnect stress
- Develop CFD models using ANSYS FLUENT for solder reflow modeling
- Collaborate with design engineering teams on package development
- Education & Experience
- Pursuing a degree in Mechanical Engineering or related field
- Academic or project experience with FEA/CFD tools and analysis
- Technical Skills
- Proficiency in SOLIDWORKS/NX, ANSYS Mechanical APDL and ANSYS FLUENT
- Understanding of semiconductor packaging materials and processes
- Strong grasp on non-linear properties of materials (elastic-plastic, viscoelastic)
- Familiarity with CoWoS-S/L/R, TSVs, or 2.5D/3D integration concepts
- Basic programming/scripting skills (APDL, Python, MATLAB)
- Knowledge of solder joint reliability and failure analysis
- Familiarity with JEDEC standards and reliability testing
- Previous internship in semiconductor industry
Program details
- 12-week paid internship (June - August 2026)
- Generous housing support for those relocating
- Daily lunch and dinner in our office
- Based at our office in San Jose, CA
- Direct mentorship from industry leaders and world-class engineers
- Opportunity to work on one of the most important problems of our time
How We’re Different
Etched believes in the Bitter Lesson. We think most of the progress in the AI field has come from using more FLOPs to train and run models, and the best way to get more FLOPs is to build model-specific hardware. Larger and larger training runs encourage companies to consolidate around fewer model architectures, which creates a market for single-model ASICs.
We are a fully in-person team in West San Jose, and greatly value engineering skills. We do not have boundaries between engineering and research, and we expect all of our technical staff to contribute to both as needed.