What are the responsibilities and job description for the Electrical Product Engineer position at EPC Space?
Company Description
EPC Space specializes in advanced, high-reliability enhancement-mode gallium nitride (GaN) power devices. These devices provide significant evolutionary advantages over traditional silicon-based solutions, particularly for space systems. The company offers Radiation Hardened (Rad Hard) GaN-based power devices designed to perform in critical space environments. These solutions are suited for applications such as power supplies, lidar, motor drives, and ion thrusters, ensuring high performance in challenging conditions.
Position: Electrical Product Engineer
Reports to: VP of Engineering
Location: Andover, MA
Key Responsibilities
- Product Lifecycle Management: Oversee the full back-end process from wafer receipt through assembly, testing, and packaging qualification to volume production and sustainment.
- Yield Improvement and Optimization: Analyze assembly and test data to drive yield enhancements, reduce defects, and optimize processes in internal facilities. Collaborate closely with front-end fab and design teams for holistic improvements.
- New Product Introduction (NPI): Coordinate qualification of new devices, including process development, test program validation, and ramp to high-volume manufacturing. Ensure seamless handoff from R&D/design to production.
- Quality and Reliability Engineering: Perform failure analysis, root cause investigations, and reliability qualifications. Manage product qualifications and compliance for internal standards.
- Test Development and Support: Develop or oversee test hardware/program development for ATE (Automated Test Equipment), ensuring coverage for functional, parametric, and system-level testing.
- Cross-Functional Integration: Work directly with design, process integration, fab operations, and quality teams to resolve issues. Support product changes, cost reductions, and continuous improvement (e.g., Six Sigma projects)
- Sustaining Engineering: Monitor production metrics, handle excursions, implement corrective actions, and support end-of-life or portfolio management for mature products
Required Qualifications
- Education: Bachelor's or Master's degree in Electrical Engineering or Applied Physics.
- Experience: 3–8 years in semiconductor back-end processes (assembly, packaging, test).
- Skills:
- Deep knowledge of assembly processes (e.g., bonding, encapsulation) and test methodologies (wafer probe, final test).
- Proficiency in data analysis tools (e.g., JMP, Python, SQL) and statistical techniques (SPC, DOE).
- Familiarity with reliability testing and standards
- Strong problem-solving, project management, and communication skills for internal collaboration.