What are the responsibilities and job description for the Package Designer position at Comprehensive Resources Inc.?
Job Details
Position: Package Designer
Location: San Jose (Onsite / Work from Office)
Total Experience: 5 Years
We are looking for an experienced Packaging Designer to develop creative, efficient, and cost-effective packaging solutions.
Job Description:
- Create Netlists and BGA designs as per input specifications.
- Conduct feasibility studies to determine optimal pad layouts, interconnect types, and substrate parameters for IC devices or applications.
- Define substrate stack-ups, routing strategies, and via structures.
- Design substrates for RF, digital, high-speed, and mixed-signal dies.
- Excellent understanding of SI/PI requirements for routing HSIO (DDR, SERDES, etc.).
- Strong experience with UCIE (Advanced & Standard) and HBM technologies.
- Set and validate Design Rule Checks (DRC) to ensure compliance with manufacturing, assembly, and design guidelines.
- Optimize die breakout and high-power signal patterns.
- Deep understanding of HDI substrate technologies, layout design rules, and material properties.
- Verify designs for electrical, thermal, mechanical, and manufacturability standards.
- Knowledge of different package types.
- Experience with Wire bond, Flip chip, and advanced packaging (2.5D, 3D, RDL, embedded passives, etc.).
- Strong exposure to CoWoS (Chip-on-Wafer-on-Substrate) interposer design and substrate support.
- Familiarity with OSAT design rules.
Qualification:
Bachelor's degree in Electronics / Electrical Engineering
3 8 years of experience in IC package design & development
Proficiency in Cadence Allegro Package Designer
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