What are the responsibilities and job description for the Failure Analysis Engineer position at Avicena Tech?
Avicena is a privately held company developing microLED based ultra-low power high bandwidth interconnects for chip-to-chip communications. This technology will revolutionize High-Performance (HPC) and Cloud computing, as well as other industries where low power interconnects are critical like camera sensors, autonomous vehicles, and aerospace. Avicena is headquartered in Sunnyvale, California with a development center in Edinburgh, Scotland. The company was founded in 2019 by leading technologists from the optical networking industry with a track record of delivering breakthrough products. (www.avicena.tech)
About The Role
As a Failure Analysis Engineer at Avicena, you will be the technical detective behind our microLED and photodetector device programs — isolating, characterizing, and root-causing failures across devices, arrays, and integrated modules. Your findings will directly steer design, process, and reliability decisions for the LightBundle™ platform, closing the loop between what fails in the lab and how we build it better.
Responsibilities
Avicena offers a competitive compensation package including base salary, equity, and comprehensive benefits, along with the opportunity to make foundational contributions to a category-defining technology. Actual compensation will be determined based on experience, qualifications, and location.
Avicena is an Equal Opportunity Employer. We are committed to building a diverse and inclusive team and do not discriminate on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, veteran status, or any other protected characteristic. Applicants must be authorized to work in the United States.
About The Role
As a Failure Analysis Engineer at Avicena, you will be the technical detective behind our microLED and photodetector device programs — isolating, characterizing, and root-causing failures across devices, arrays, and integrated modules. Your findings will directly steer design, process, and reliability decisions for the LightBundle™ platform, closing the loop between what fails in the lab and how we build it better.
Responsibilities
- Root-cause analysis: Lead end-to-end failure analysis of GaN microLEDs, photodetector arrays, and integrated interconnect modules, from failure isolation through physical root cause and corrective action.
- FA techniques: Plan and perform electrical, optical, and physical FA including EL/PL imaging, SIMS, EMMI/photoemission, OBIRCH/thermal, curve tracing, and fault localization on single devices and dense arrays.
- Physical analysis: Direct and interpret cross-sectioning and imaging (FIB, SEM, TEM, EDX, CT/acoustic microscopy) to identify defects, material anomalies, and interface issues.
- Failure characterization: Build failure signatures and defect libraries; distinguish process-induced, design-induced, and stress-induced failure modes.
- Feedback loop: Translate FA findings into actionable recommendations for device, process, packaging, and reliability teams, and verify effectiveness of corrective actions.
- Reporting: Produce clear, rigorous FA reports and present root-cause conclusions to engineering and leadership; support customer and foundry-facing analyses.
- Education: MS or PhD in Electrical Engineering, Materials Science, Physics, or a related field (or BS with equivalent industry experience).
- Experience: 5–8 years of failure analysis experience in semiconductor, optoelectronic, or photonic devices.
- Root-cause rigor: Demonstrated ability to drive structured root-cause investigations (8D, fishbone, fault-tree) to definitive physical conclusions.
- Device physics: Solid understanding of semiconductor and optoelectronic device physics and common failure/degradation mechanisms.
- Analysis skills: Proficiency in data analysis and scripting (e.g., Python, MATLAB) and strong technical communication.
- GaN microLEDs: Prior experience with GaN-based microLED or LED/laser failure analysis is strongly preferred but not required.
- Experience with FA on high-density emitter or detector arrays.
- Familiarity with packaging, hybrid bonding, or heterogeneous-integration failure modes.
- Experience supporting reliability qualification and correlating FA to stress-test results.
- Background in optical/photonic module or interconnect FA.
Avicena offers a competitive compensation package including base salary, equity, and comprehensive benefits, along with the opportunity to make foundational contributions to a category-defining technology. Actual compensation will be determined based on experience, qualifications, and location.
Avicena is an Equal Opportunity Employer. We are committed to building a diverse and inclusive team and do not discriminate on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, veteran status, or any other protected characteristic. Applicants must be authorized to work in the United States.